Euisun Choi

Follow

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus including bonding head
- Patent number 12,136,563
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR STACKING CHIP
- Publication number 20250226354
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Ahra JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING APPARATUS
- Publication number 20250201602
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sunwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
- Publication number 20230163094
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Euisun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING BONDING HEAD
- Publication number 20220102185
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Mingu Lee
- H01 - BASIC ELECTRIC ELEMENTS