Eun Hye Do

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,996,392
- Issue date May 28, 2024
- SK hynix Inc.
- Eun Hye Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 11,664,351
- Issue date May 30, 2023
- SK hynix Inc.
- Eun Hye Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including stacked semiconductor dies
- Patent number 10,903,189
- Issue date Jan 26, 2021
- SK hynix Inc.
- Eun Hye Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing ginsenosides 20(S)-Rg3 and 20(S)-Rh2 using gins...
- Patent number 10,870,857
- Issue date Dec 22, 2020
- Modnbio, Inc.
- Jong Cheon Hahm
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Substrate for semiconductor package and semiconductor package havin...
- Patent number 9,679,865
- Issue date Jun 13, 2017
- SK hynix Inc.
- Eun Hye Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and method for manufacturing the same
- Patent number 9,305,912
- Issue date Apr 5, 2016
- SK Hynix Inc.
- Hee Min Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and method for manufacturing the same
- Patent number 9,082,634
- Issue date Jul 14, 2015
- SK Hynix Inc.
- Hee-Min Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip unit and stack package having the same
- Patent number 8,564,141
- Issue date Oct 22, 2013
- SK Hynix Inc.
- Kyu Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package and method for manufacturing the same
- Patent number 8,476,751
- Issue date Jul 2, 2013
- SK Hynix Inc.
- Kyu Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package and method for manufacturing the same
- Patent number 7,859,108
- Issue date Dec 28, 2010
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACK PACKAGES
- Publication number 20240339436
- Publication date Oct 10, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH VIAS OF VARIOUS SHAPES AND METHOD...
- Publication number 20240258201
- Publication date Aug 1, 2024
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20230253371
- Publication date Aug 10, 2023
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
- Publication number 20220059504
- Publication date Feb 24, 2022
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING STACKED SEMICONDUCTOR DIES
- Publication number 20200091112
- Publication date Mar 19, 2020
- SK HYNIX INC.
- Eun Hye DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING GINSENOSIDES 20(S)-RG3 AND 20(S)-RH2 USING GINS...
- Publication number 20190194667
- Publication date Jun 27, 2019
- MODNBIO, INC.
- Jong Cheon Hahm
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150270252
- Publication date Sep 24, 2015
- SK HYNIX INC.
- Hee Min SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVIN...
- Publication number 20150131255
- Publication date May 14, 2015
- SK HYNIX INC.
- Eun Hye DO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130256887
- Publication date Oct 3, 2013
- SK HYNIX INC.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120018879
- Publication date Jan 26, 2012
- Hynix Semiconductor Inc.
- Hee Min SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP UNIT AND STACK PACKAGE HAVING THE SAME
- Publication number 20110272798
- Publication date Nov 10, 2011
- Hynix Semiconductor Inc.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110272820
- Publication date Nov 10, 2011
- Hynix Semiconductor Inc.
- Kyu Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...
- Publication number 20110189928
- Publication date Aug 4, 2011
- Hynix Semiconductor Inc.
- Hee Min SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...
- Publication number 20100092718
- Publication date Apr 15, 2010
- Hee Min SHIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090140426
- Publication date Jun 4, 2009
- Woong Sun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Semiconductor package including stacked semiconductor chips

Semiconductor package including stacked semiconductor chips

Stack packages including stacked semiconductor dies

Method of producing ginsenosides 20(S)-Rg3 and 20(S)-Rh2 using gins...

Substrate for semiconductor package and semiconductor package havin...

Stack package and method for manufacturing the same

Stack package and method for manufacturing the same

Chip unit and stack package having the same

Stacked semiconductor package and method for manufacturing the same

Flip chip package and method for manufacturing the same

Patents Applicationslast 30 patents

STACK PACKAGES

SEMICONDUCTOR DEVICE WITH THROUGH VIAS OF VARIOUS SHAPES AND METHOD...

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS

STACK PACKAGES INCLUDING STACKED SEMICONDUCTOR DIES

METHOD OF PRODUCING GINSENOSIDES 20(S)-RG3 AND 20(S)-RH2 USING GINS...

STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVIN...

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP UNIT AND STACK PACKAGE HAVING THE SAME

STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...

WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING TH...

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME