Eun Jin Jeong

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Chungbuk, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming duplex plated bump-on-le...
- Patent number 9,799,621
- Issue date Oct 24, 2017
- STATS ChipPAC Pte. Ltd.
- Soo Won Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Duplex Plated Bump-On-Le...
- Publication number 20140327135
- Publication date Nov 6, 2014
- Soo Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Duplex Plated Bump-On-Le...
- Publication number 20130249076
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Soo Won Lee
- H01 - BASIC ELECTRIC ELEMENTS