Eun-Young Min

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Anyang-city, KR

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Patents Grantslast 30 patents

Information Patent Grant
Contact forming method for semiconductor device
- Patent number 6,555,450
- Issue date Apr 29, 2003
- Samsung Electronics Co., Ltd.
- Young-Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structures for semiconductor devices and fabrication me...
- Patent number 6,465,895
- Issue date Oct 15, 2002
- Samsung Electronics Co., Ltd.
- Young-hoon Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD STRUCTURES FOR SEMICONDUCTOR DEVICES AND FABRICATION ME...
- Publication number 20020145206
- Publication date Oct 10, 2002
- SAMSUNG ELECTRONICS CO., LTD.
- Young-Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact forming method for semiconductor device
- Publication number 20020068423
- Publication date Jun 6, 2002
- Young-Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS