Eunchul Ahn

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,035,308
- Issue date May 19, 2015
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 8,815,731
- Issue date Aug 26, 2014
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates, semiconductor packages having the same, and met...
- Patent number 8,759,221
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 8,558,400
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates and semiconductor packages having the same
- Patent number 8,497,569
- Issue date Jul 30, 2013
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing bonding structure, bonding structure an...
- Patent number 8,491,982
- Issue date Jul 23, 2013
- Samsung Electronics Co., Ltd.
- Eunchul Ahn
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 8,053,881
- Issue date Nov 8, 2011
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20150270242
- Publication date Sep 24, 2015
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140374883
- Publication date Dec 25, 2014
- Samsung Electronics Co., Ltd.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20140151863
- Publication date Jun 5, 2014
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...
- Publication number 20130288431
- Publication date Oct 31, 2013
- Samsung Electronics Co., Ltd.
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING A PACKAGE-ON-PACKAGE DEVICE AND PACKAGE-ON-P...
- Publication number 20130178016
- Publication date Jul 11, 2013
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Fabricating The Same
- Publication number 20120091579
- Publication date Apr 19, 2012
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR BUMP REFLOW AND METHODS OF FORMING BUMPS USING THE SAME
- Publication number 20120031953
- Publication date Feb 9, 2012
- Samsung Electronics Co., Ltd.
- Myeong Soon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20120001329
- Publication date Jan 5, 2012
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...
- Publication number 20110215444
- Publication date Sep 8, 2011
- Samsung Electronics Co., Ltd.
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING BONDING STRUCTURE, BONDING STRUCTURE AN...
- Publication number 20110186220
- Publication date Aug 4, 2011
- Samsung Electronics Co., Ltd.
- Eunchul Ahn
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF FORMING CONNECTION TERMINAL
- Publication number 20100190333
- Publication date Jul 29, 2010
- Samsung Electronics Co., Ltd.
- Myeong-Soon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, semiconductor module, and method for fabrica...
- Publication number 20100096754
- Publication date Apr 22, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Jonggi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20100072593
- Publication date Mar 25, 2010
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Eunchul Ahn

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Package substrates, semiconductor packages having the same, and met...

Semiconductor packages and methods of fabricating the same

Package substrates and semiconductor packages having the same

Apparatus for manufacturing bonding structure, bonding structure an...

Semiconductor package and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...

METHODS OF FABRICATING A PACKAGE-ON-PACKAGE DEVICE AND PACKAGE-ON-P...

Semiconductor Packages And Methods Of Fabricating The Same

APPARATUS FOR BUMP REFLOW AND METHODS OF FORMING BUMPS USING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...

APPARATUS FOR MANUFACTURING BONDING STRUCTURE, BONDING STRUCTURE AN...

METHOD OF FORMING CONNECTION TERMINAL

Semiconductor package, semiconductor module, and method for fabrica...

Semiconductor package and method for manufacturing the same