Eung San Cho

Person

Torrance, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 12,255,114
- Issue date Mar 18, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an electrically insulating core with e...
- Patent number 12,014,964
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with embedded flexible circuit
- Patent number 11,916,007
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Ashutosh Baheti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package with electrically isolating dielectric liner
- Patent number 11,881,437
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 11,870,130
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package with via structure and method of formation thereof
- Patent number 11,817,617
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,776,882
- Issue date Oct 3, 2023
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a solderable contact pad formed by a l...
- Patent number 11,532,541
- Issue date Dec 20, 2022
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 11,502,012
- Issue date Nov 15, 2022
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Space efficient and low parasitic half bridge
- Patent number 11,469,164
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating a semiconductor pac...
- Patent number 11,302,610
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package and method of formation thereof
- Patent number 11,258,162
- Issue date Feb 22, 2022
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper pillar interconnect structure
- Patent number 11,152,321
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Input/output pins for chip-embedded substrate
- Patent number 11,101,221
- Issue date Aug 24, 2021
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power stage device with carrier frame for power stage module and in...
- Patent number 10,818,646
- Issue date Oct 27, 2020
- Infineon Technologies AG
- Petteri Palm
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Reinforcement for electrical connectors
- Patent number 10,700,037
- Issue date Jun 30, 2020
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad and clip configuration for packaged semiconductor device
- Patent number 10,692,801
- Issue date Jun 23, 2020
- Infineon Technologies Austria AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding into printed circuit board with drilling
- Patent number 10,681,819
- Issue date Jun 9, 2020
- Infineon Technologies Austria AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter with at least five electrical connections on a side
- Patent number 10,666,140
- Issue date May 26, 2020
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase power converter with common connections
- Patent number 10,573,631
- Issue date Feb 25, 2020
- Infineon Technologies Americas Corp.
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Single-sided power device package
- Patent number 10,490,505
- Issue date Nov 26, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package including flip chip mounted IC and vertically...
- Patent number 10,332,825
- Issue date Jun 25, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated shunt in circuit package
- Patent number 10,242,938
- Issue date Mar 26, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Breakable substrate for semiconductor die
- Patent number 10,204,873
- Issue date Feb 12, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-phase common contact package
- Patent number 10,204,847
- Issue date Feb 12, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding into printed circuit board with drilling
- Patent number 10,206,286
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Eung San Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Powerstage attached to inductor
- Patent number 10,135,335
- Issue date Nov 20, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Common contact leadframe for multiphase applications
- Patent number 10,128,173
- Issue date Nov 13, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...
- Publication number 20240332099
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR CONNECTIVITY AND ASSEMBLIES
- Publication number 20240249870
- Publication date Jul 25, 2024
- Infineon Technologies Austria AG
- Kushal KSHIRSAGAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
- Publication number 20240120248
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES
- Publication number 20240107674
- Publication date Mar 28, 2024
- Infineon Technologies Austria AG
- Eung San Cho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Antenna Apparatus and Fabrication Method
- Publication number 20240097313
- Publication date Mar 21, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Package with Via Structure and Method of Formation Thereof
- Publication number 20240047855
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR POWER DEVICE PACKAGE EMBEDDED IN CIRCUIT CARRIER
- Publication number 20240030820
- Publication date Jan 25, 2024
- INFINEON TECHNOLOGIES AG
- Angela Kessler
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Semiconductor Device Package Thermally Coupled to Passive Element
- Publication number 20230369160
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Device Power Module Arrangement
- Publication number 20230369256
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Kushal Kshirsagar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Package with Electrically Isolating Dielectric Liner
- Publication number 20230130659
- Publication date Apr 27, 2023
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having an Electrically Insulating Core with E...
- Publication number 20230077139
- Publication date Mar 9, 2023
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Low Parasitic Connection to Passive Device
- Publication number 20230017391
- Publication date Jan 19, 2023
- INFINEON TECHNOLOGIES AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20220230941
- Publication date Jul 21, 2022
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Package and Method of Formation Thereof
- Publication number 20220085484
- Publication date Mar 17, 2022
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Package with Via Structure and Method of Formation Thereof
- Publication number 20220059925
- Publication date Feb 24, 2022
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Fabrication Method
- Publication number 20220029271
- Publication date Jan 27, 2022
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20210233823
- Publication date Jul 29, 2021
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Solderable Contact Pad Formed by a L...
- Publication number 20210233837
- Publication date Jul 29, 2021
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Space Efficient and Low Parasitic Half Bridge
- Publication number 20210225745
- Publication date Jul 22, 2021
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH EMBEDDED FLEXIBLE CIRCUIT
- Publication number 20210125901
- Publication date Apr 29, 2021
- INFINEON TECHNOLOGIES AG
- Ashutosh Baheti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Copper Pillar Interconnect Structure
- Publication number 20200258855
- Publication date Aug 13, 2020
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Stage Device with Carrier Frame for Power Stage Module and In...
- Publication number 20200258873
- Publication date Aug 13, 2020
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Fabricating a Semiconductor Pac...
- Publication number 20200135619
- Publication date Apr 30, 2020
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Pad and Clip Configuration for Packaged Semiconductor Device
- Publication number 20190371711
- Publication date Dec 5, 2019
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCEMENT FOR ELECTRICAL CONNECTORS
- Publication number 20190148332
- Publication date May 16, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING
- Publication number 20190124773
- Publication date Apr 25, 2019
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING
- Publication number 20180376598
- Publication date Dec 27, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PHASE POWER CONVERTER WITH COMMON CONNECTIONS
- Publication number 20180350789
- Publication date Dec 6, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHUNT IN CIRCUIT PACKAGE
- Publication number 20180337115
- Publication date Nov 22, 2018
- Infineon Technologies America Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BREAKABLE SUBSTRATE FOR SEMICONDUCTOR DIE
- Publication number 20180323156
- Publication date Nov 8, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Eung San Cho

Person

Patents Grantslast 30 patents

Antenna apparatus and fabrication method

Embedded package with electrically isolating dielectric liner

Semiconductor package having an electrically insulating core with e...

Semiconductor package with low parasitic connection to passive device

Semiconductor device with embedded flexible circuit

Embedded package with electrically isolating dielectric liner

Antenna apparatus and fabrication method

Antenna package with via structure and method of formation thereof

Method of fabricating a semiconductor package

Semiconductor package having a solderable contact pad formed by a l...

Semiconductor packages and methods of manufacturing thereof

Space efficient and low parasitic half bridge

Semiconductor package and method of fabricating a semiconductor pac...

Antenna package and method of formation thereof

Semiconductor device having a copper pillar interconnect structure

Input/output pins for chip-embedded substrate

Power stage device with carrier frame for power stage module and in...

Reinforcement for electrical connectors

Bond pad and clip configuration for packaged semiconductor device

Embedding into printed circuit board with drilling

Power converter with at least five electrical connections on a side

Multi-phase power converter with common connections

Single-sided power device package

Semiconductor package including flip chip mounted IC and vertically...

Integrated shunt in circuit package

Breakable substrate for semiconductor die

Multi-phase common contact package

Embedding into printed circuit board with drilling

Powerstage attached to inductor

Common contact leadframe for multiphase applications

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...

INDUCTOR CONNECTIVITY AND ASSEMBLIES

Embedded Package with Electrically Isolating Dielectric Liner

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

Antenna Apparatus and Fabrication Method

Antenna Package with Via Structure and Method of Formation Thereof

MODULAR POWER DEVICE PACKAGE EMBEDDED IN CIRCUIT CARRIER

Semiconductor Device Package Thermally Coupled to Passive Element

Multi-Device Power Module Arrangement

Embedded Package with Electrically Isolating Dielectric Liner

Semiconductor Package Having an Electrically Insulating Core with E...

Semiconductor Package with Low Parasitic Connection to Passive Device

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

Antenna Package and Method of Formation Thereof

Antenna Package with Via Structure and Method of Formation Thereof

Antenna Apparatus and Fabrication Method

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

Semiconductor Package Having a Solderable Contact Pad Formed by a L...

Space Efficient and Low Parasitic Half Bridge

SEMICONDUCTOR DEVICE WITH EMBEDDED FLEXIBLE CIRCUIT

Semiconductor Device Having a Copper Pillar Interconnect Structure

Power Stage Device with Carrier Frame for Power Stage Module and In...

Semiconductor Package and Method of Fabricating a Semiconductor Pac...

Bond Pad and Clip Configuration for Packaged Semiconductor Device

REINFORCEMENT FOR ELECTRICAL CONNECTORS

EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING

EMBEDDING INTO PRINTED CIRCUIT BOARD WITH DRILLING

MULTI-PHASE POWER CONVERTER WITH COMMON CONNECTIONS

INTEGRATED SHUNT IN CIRCUIT PACKAGE

BREAKABLE SUBSTRATE FOR SEMICONDUCTOR DIE