EUNGKYU KIM

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including thermal exhaust pathway
- Patent number 12,009,274
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Eungkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,929,316
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,646,260
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including substrate with outer insulating layer
- Patent number 11,508,649
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Eungkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128155
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minjun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120286
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyeonseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240006262
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Kyungdon MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230207441
- Publication date Jun 29, 2023
- JONGYOUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STIFFENER
- Publication number 20230046098
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415835
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Minjun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THERMAL EXHAUST PATHWAY
- Publication number 20220262699
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- EUNGKYU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SUBSTRATE WITH OUTER INSULATING LAYER
- Publication number 20220084924
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- EUNGKYU KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220059444
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- JONGYOUN KIM
- H01 - BASIC ELECTRIC ELEMENTS

EUNGKYU KIM

Person

Patents Grantslast 30 patents

Semiconductor package including thermal exhaust pathway

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor package including substrate with outer insulating layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING STIFFENER

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING THERMAL EXHAUST PATHWAY

SEMICONDUCTOR PACKAGE INCLUDING SUBSTRATE WITH OUTER INSULATING LAYER

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME