Eunhee JUNG

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 12,062,605
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 11,658,107
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an in interposer and method of fabr...
- Patent number 11,367,679
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, method of manufacturing the same, and method of man...
- Patent number 11,131,568
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- G01 - MEASURING TESTING
Information Patent Grant
Gas sensor package
- Patent number 11,125,734
- Issue date Sep 21, 2021
- Samsung Electronics Co., Ltd.
- Inho Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor package and sensing apparatus including the same
- Patent number 11,067,554
- Issue date Jul 20, 2021
- Samsung Electronics Co., Ltd.
- Minjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having second pad electrically connected thro...
- Patent number 10,923,428
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, method of manufacturing the same, and method of man...
- Patent number 10,760,930
- Issue date Sep 1, 2020
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20230260891
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20220319973
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20210183757
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...
- Publication number 20200386585
- Publication date Dec 10, 2020
- Samsung Electronics Co., Ltd.
- Sungeun JO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200020637
- Publication date Jan 16, 2020
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SENSOR PACKAGE AND SENSING APPARATUS INCLUDING THE SAME
- Publication number 20190212312
- Publication date Jul 11, 2019
- Samsung Electronics Co., Ltd.
- Minjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SENSOR PACKAGE
- Publication number 20190204281
- Publication date Jul 4, 2019
- Samsung Electronics Co., Ltd.
- INHO CHOI
- G01 - MEASURING TESTING
Information Patent Application
SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...
- Publication number 20190186960
- Publication date Jun 20, 2019
- Samsung Electronics Co., Ltd.
- Sungeun JO
- G01 - MEASURING TESTING

Eunhee JUNG

Person

Patents Grantslast 30 patents

Semiconductor package including an interposer and method of fabrica...

Semiconductor package including an interposer and method of fabrica...

Semiconductor package including an in interposer and method of fabr...

Sensor package, method of manufacturing the same, and method of man...

Gas sensor package

Gas sensor package and sensing apparatus including the same

Semiconductor package having second pad electrically connected thro...

Sensor package, method of manufacturing the same, and method of man...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...

SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...

SEMICONDUCTOR PACKAGE

GAS SENSOR PACKAGE AND SENSING APPARATUS INCLUDING THE SAME

GAS SENSOR PACKAGE

SENSOR PACKAGE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MAN...