Eunkyoung CHOI

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having stiffener structure
- Patent number 12,027,471
- Issue date Jul 2, 2024
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stiffening structure
- Patent number 11,776,918
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips and dummy pad
- Patent number 11,664,346
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,557,543
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stiffening structure
- Patent number 11,315,886
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE
- Publication number 20240321776
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- EUNKYOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230066895
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE
- Publication number 20220399287
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- EUNKYOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE
- Publication number 20220223543
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Eunkyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220028791
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- EUNKYOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS AND DUMMY PAD
- Publication number 20220013497
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- EUNKYOUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE
- Publication number 20210151388
- Publication date May 20, 2021
- Samsung Electronics Co., Ltd.
- Eunkyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Eunkyoung CHOI

Person

Patents Grantslast 30 patents

Semiconductor package having stiffener structure

Semiconductor package having stiffening structure

Semiconductor package including semiconductor chips and dummy pad

Semiconductor package

Semiconductor package having stiffening structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE

INDUCTOR AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE HAVING STIFFENER STRUCTURE

SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS AND DUMMY PAD

SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE