EunNaRa Cho

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 12,187,603
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,009,289
- Issue date Jun 11, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 11,572,269
- Issue date Feb 7, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having EMI shielding structure and related met...
- Patent number 11,355,449
- Issue date Jun 7, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Young Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,152,296
- Issue date Oct 19, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a polymer substrate
- Patent number 10,822,226
- Issue date Nov 3, 2020
- Amkor Technology, Inc.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,144,634
- Issue date Dec 4, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,032,705
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,809,446
- Issue date Nov 7, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,056,765
- Issue date Jun 16, 2015
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,018,741
- Issue date Apr 28, 2015
- Amkor Technology, Inc.
- Dong In Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332159
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...
- Publication number 20240088059
- Publication date Mar 14, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Young Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20230257257
- Publication date Aug 17, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220051973
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20210047172
- Publication date Feb 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Yung Woo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...
- Publication number 20200251422
- Publication date Aug 6, 2020
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20190152770
- Publication date May 23, 2019
- Amkor Technology, Inc.
- YungWoo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...
- Publication number 20180374798
- Publication date Dec 27, 2018
- Amkor Technology, Inc.
- Young Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180350734
- Publication date Dec 6, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180134546
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Ji Hoon Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180057353
- Publication date Mar 1, 2018
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170320723
- Publication date Nov 9, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170018493
- Publication date Jan 19, 2017
- Amkor Technology, Inc.
- Jae Ung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
- Publication number 20160221820
- Publication date Aug 4, 2016
- Amkor Technology, Inc.
- YungWoo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package And Manufacturing Method Thereof
- Publication number 20150274511
- Publication date Oct 1, 2015
- Amkor Technology, Inc.
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140017843
- Publication date Jan 16, 2014
- Jong Dae Jung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130154066
- Publication date Jun 20, 2013
- Amkor Technology, Inc.
- Dong In Kim
- H01 - BASIC ELECTRIC ELEMENTS

EunNaRa Cho

Person

Patents Grantslast 30 patents

Semiconductor package using a polymer substrate

Semiconductor package and manufacturing method thereof

Semiconductor package using a polymer substrate

Semiconductor device having EMI shielding structure and related met...

Semiconductor package and manufacturing method thereof

Semiconductor package using a polymer substrate

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE

Semiconductor Package And Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF