Eunseok CHO

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,176,262
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,798,862
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling packages and thermal management methods thereof
- Patent number 10,658,266
- Issue date May 19, 2020
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Surface temperature management method of mobile device and memory t...
- Patent number 10,198,049
- Issue date Feb 5, 2019
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermoelectric cooling packages and thermal management methods thereof
- Patent number 9,671,141
- Issue date Jun 6, 2017
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Surface temperature management method of mobile device and memory t...
- Patent number 9,606,591
- Issue date Mar 28, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,252,031
- Issue date Feb 2, 2016
- Samsung Electronics Co., Ltd.
- Hohyeuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling packages and thermal management methods thereof
- Patent number 9,228,763
- Issue date Jan 5, 2016
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Chip-on-film packages and device assemblies including the same
- Patent number 9,030,826
- Issue date May 12, 2015
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display devices
- Patent number 8,988,645
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Jichul Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device and method for controlling temperature thereof
- Patent number 8,988,115
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor devices and methods of controlling temperature thereof
- Patent number 8,692,349
- Issue date Apr 8, 2014
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor packages including heat slugs
- Patent number 8,269,342
- Issue date Sep 18, 2012
- Samsung Electronics Co., Ltd.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218969
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Hongwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183214
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125236
- Publication date Apr 17, 2025
- SAMUNG ELECTRONICS CO., LTD.
- Hyungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250069979
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240030089
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220108935
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
- Publication number 20170229373
- Publication date Aug 10, 2017
- Jae Choon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...
- Publication number 20170185119
- Publication date Jun 29, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- G01 - MEASURING TESTING
Information Patent Application
THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
- Publication number 20160084542
- Publication date Mar 24, 2016
- JAE CHOON KIM
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150084170
- Publication date Mar 26, 2015
- Hohyeuk IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140327129
- Publication date Nov 6, 2014
- Eunseok CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF
- Publication number 20140184312
- Publication date Jul 3, 2014
- Samsung Electronics Co., Ltd.
- Jae Choon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE DEVICE AND DATA COMMUNICATION METHOD OF SEMICONDUCTOR INTEGR...
- Publication number 20140136827
- Publication date May 15, 2014
- EUNSEOK CHO
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR CONTROLLING TEMPERATURE THEREOF
- Publication number 20130321041
- Publication date Dec 5, 2013
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF
- Publication number 20130166093
- Publication date Jun 27, 2013
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF
- Publication number 20130139524
- Publication date Jun 6, 2013
- Jae Choon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...
- Publication number 20130091348
- Publication date Apr 11, 2013
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICES
- Publication number 20130057559
- Publication date Mar 7, 2013
- Samsung Electronics Co., Ltd.
- Jichul KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP-ON-FILM PACKAGES AND DEVICE ASSEMBLIES INCLUDING THE SAME
- Publication number 20130021768
- Publication date Jan 24, 2013
- Jichul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices And Methods Of Controlling Temperature Thereof
- Publication number 20120133427
- Publication date May 31, 2012
- Samsung Electronics Co., Ltd.
- Jae Choon Kim
- G05 - CONTROLLING REGULATING
Information Patent Application
Semiconductor packages including heat slugs
- Publication number 20110018119
- Publication date Jan 27, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Yonghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Eunseok CHO

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package

Thermoelectric cooling packages and thermal management methods thereof

Surface temperature management method of mobile device and memory t...

Thermoelectric cooling packages and thermal management methods thereof

Surface temperature management method of mobile device and memory t...

Semiconductor package and method of fabricating the same

Thermoelectric cooling packages and thermal management methods thereof

Chip-on-film packages and device assemblies including the same

Display devices

Electronic device and method for controlling temperature thereof

Semiconductor devices and methods of controlling temperature thereof

Semiconductor packages including heat slugs

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF

SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...

THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE ON PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF

MOBILE DEVICE AND DATA COMMUNICATION METHOD OF SEMICONDUCTOR INTEGR...

ELECTRONIC DEVICE AND METHOD FOR CONTROLLING TEMPERATURE THEREOF

ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF

THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF

SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY T...

DISPLAY DEVICES

CHIP-ON-FILM PACKAGES AND DEVICE ASSEMBLIES INCLUDING THE SAME

Semiconductor Devices And Methods Of Controlling Temperature Thereof

Semiconductor packages including heat slugs