Eunsil KANG

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package
- Publication number 20250079425
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Eunsil Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20220173008
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS