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Eunsu LEE

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  • Asan-si, KR
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Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE PACKAGE
    • Publication number 20250046724
    • Publication date Feb 6, 2025
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250038080
    • Publication date Jan 30, 2025
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250006567
    • Publication date Jan 2, 2025
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240429194
    • Publication date Dec 26, 2024
    • SAMSUNG ELECTRONICS CO,. LTD.
    • EUNSU LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF CHIPS SEQUENTIALLY S...
    • Publication number 20240379481
    • Publication date Nov 14, 2024
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING...
    • Publication number 20240339336
    • Publication date Oct 10, 2024
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240321847
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20240234286
    • Publication date Jul 11, 2024
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240203942
    • Publication date Jun 20, 2024
    • Samsung Electronics Co., Ltd.
    • Doyoung Jang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGES
    • Publication number 20240136272
    • Publication date Apr 25, 2024
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
    • Publication number 20240096840
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • Eunsu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230352460
    • Publication date Nov 2, 2023
    • Samsung Electronics Co., Ltd.
    • Eunsu LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230139141
    • Publication date May 4, 2023
    • Samsung Electronics Co., Ltd.
    • Doyoung Jang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230114274
    • Publication date Apr 13, 2023
    • Samsung Electronics Co., Ltd.
    • Jeonghyun LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20220359439
    • Publication date Nov 10, 2022
    • Samsung Electronics Co., Ltd.
    • Eunsu LEE
    • H01 - BASIC ELECTRIC ELEMENTS