Eunsuk JUNG

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages stacked by wafer bonding process and methods...
- Patent number 11,810,900
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna cable connecting module and method for producing antenna ca...
- Patent number 10,847,938
- Issue date Nov 24, 2020
- KMW Inc.
- Sunghwan So
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240038732
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20220013503
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Eunsuk Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA CABLE CONNECTING MODULE AND METHOD FOR PRODUCING ANTENNA CA...
- Publication number 20190081443
- Publication date Mar 14, 2019
- KMW INC.
- Sunghwan SO
- H01 - BASIC ELECTRIC ELEMENTS