Evan P. Smouse

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Corvallis, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Interconnected printhead die and carrier substrate system
- Patent number 6,554,399
- Issue date Apr 29, 2003
- Hewlett-Packard Development Company, L.P.
- Marvin G Wong
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid ejecting device with varied nozzle spacing
- Patent number 6,394,579
- Issue date May 28, 2002
- Hewlett-Packard Company
- Melissa D. Boyd
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
Interconnected printhead die and carrier substrate system
- Publication number 20020118254
- Publication date Aug 29, 2002
- Marvin G. Wong
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS