Eytan Hendel

Person

  • Rehovot, IL

Patents Grantslast 30 patents

  • Information Patent Grant

    Securing a wafer to a chuck

    • Patent number 12,293,936
    • Issue date May 6, 2025
    • Applied Materials Israel Ltd.
    • Dekel Yadid
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SECURING A WAFER TO A CHUCK

    • Publication number 20240266204
    • Publication date Aug 8, 2024
    • APPLIED MATERIALS ISRAEL LTD.
    • Dekel Yedid
    • H01 - BASIC ELECTRIC ELEMENTS