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Ezio Bovio
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor wafer thermal removal control
Patent number
11,707,813
Issue date
Jul 25, 2023
GlobalWafers Co., Ltd.
Emanuele Corsi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for polishing pad control
Patent number
10,960,513
Issue date
Mar 30, 2021
Global Wafers Co., Ltd
Emanuele Corsi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and systems for polishing pad control
Patent number
10,946,493
Issue date
Mar 16, 2021
GlobalWafers Co., Ltd.
Emanuele Corsi
B24 - GRINDING POLISHING
Information
Patent Grant
Methods and systems for polishing pad control
Patent number
10,654,145
Issue date
May 19, 2020
GlobalWafers Co., Ltd.
Emanuele Corsi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dressing a wafer polishing pad
Patent number
7,846,006
Issue date
Dec 7, 2010
MEMC Electronic Materials, Inc.
Mark G. Stinson
B24 - GRINDING POLISHING
Information
Patent Grant
System and method for dressing a wafer polishing pad
Patent number
7,846,007
Issue date
Dec 7, 2010
MEMC Electronic Materials, Inc.
Mark G. Stinson
B24 - GRINDING POLISHING
Information
Patent Grant
Semiconductor wafer, polishing apparatus and method
Patent number
7,137,874
Issue date
Nov 21, 2006
MEMC Electronic Materials, SpA
Ezio Bovio
B24 - GRINDING POLISHING
Information
Patent Grant
Method of polishing wafers
Patent number
6,878,302
Issue date
Apr 12, 2005
MEMC Electronic Materials, SpA
Paride Corbellini
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
Publication number
20230347469
Publication date
Nov 2, 2023
GLOBALWAFERS CO., LTD.
Emanuele Corsi
B24 - GRINDING POLISHING
Information
Patent Application
SEMICONDUCTOR WAFER THERMAL REMOVAL CONTROL
Publication number
20210178547
Publication date
Jun 17, 2021
GLOBALWAFERS CO., LTD.
Emanuele Corsi
B24 - GRINDING POLISHING
Information
Patent Application
METHODS AND SYSTEMS FOR POLISHING PAD CONTROL
Publication number
20180304436
Publication date
Oct 25, 2018
GLOBALWAFERS CO., LTD.
Emanuele Corsi
B24 - GRINDING POLISHING
Information
Patent Application
METHODS AND SYSTEMS FOR POLISHING PAD CONTROL
Publication number
20180304437
Publication date
Oct 25, 2018
GLOBALWAFERS CO., LTD.
Emanuele Corsi
B24 - GRINDING POLISHING
Information
Patent Application
METHODS AND SYSTEMS FOR POLISHING PAD CONTROL
Publication number
20170001281
Publication date
Jan 5, 2017
SunEdison Semiconductor Limited (UEN201334164H)
Emanuele Corsi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLEANING TOOL FOR POLYSILICON REACTOR
Publication number
20130000672
Publication date
Jan 3, 2013
MEMC ELECTRONIC MATERIALS, S.P.A.
Ezio Bovio
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SYSTEM AND METHOD FOR DRESSING A WAFER POLISHING PAD
Publication number
20090176441
Publication date
Jul 9, 2009
MEMC Electronic Materials, Inc.
Mark G. Stinson
B24 - GRINDING POLISHING
Information
Patent Application
Dressing a Wafer Polishing Pad
Publication number
20080009231
Publication date
Jan 10, 2008
MEMC Electronic Materials, Inc.
Mark G. Stinson
B24 - GRINDING POLISHING