Fabian Hurschler

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Luzern, CH

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Patents Grantslast 30 patents

Information Patent Grant
Die ejector
- Patent number 12,062,566
- Issue date Aug 13, 2024
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detaching a semiconductor chip from a foil
- Patent number 9,039,867
- Issue date May 26, 2015
- Besi Switzerland AG
- Ernst Barmettler
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Die Ejector
- Publication number 20240363386
- Publication date Oct 31, 2024
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Ejector
- Publication number 20210391205
- Publication date Dec 16, 2021
- BESI Switzerland AG
- Fabian Hurschler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Detaching A Semiconductor Chip From A Foil
- Publication number 20130255889
- Publication date Oct 3, 2013
- Besi Switzerland AG
- Ernst Barmettler
- H01 - BASIC ELECTRIC ELEMENTS