Fabian Mohn

Person

Ennetbaden, CH

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement of a power semiconductor module and a cooler
- Patent number 12,068,174
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with low inductance gate crossing
- Patent number 12,068,290
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Arne Schroeder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric power converter device with improved integration of cooler...
- Patent number 12,016,162
- Issue date Jun 18, 2024
- Audi AG
- Thomas Gradinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with highly reliable chip topside
- Patent number 11,538,734
- Issue date Dec 27, 2022
- Hitachi Energy Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor module by using adhesive attac...
- Patent number 11,348,896
- Issue date May 31, 2022
- Audi AG
- Chunlei Liu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Heat dissipation for power switches
- Patent number 11,343,943
- Issue date May 24, 2022
- ABB Schweiz AG
- Giovanni Salvatore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing of a power semiconductor module
- Patent number 11,189,556
- Issue date Nov 30, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module with coaxial arrangement of the DC terminals
- Patent number 11,018,117
- Issue date May 25, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin encapsulated power semiconductor module with exposed terminal...
- Patent number 10,950,516
- Issue date Mar 16, 2021
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module based on multi-layer circuit board
- Patent number 10,636,732
- Issue date Apr 28, 2020
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,283,454
- Issue date May 7, 2019
- ABB Schweiz AG
- Felix Traub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics module with first and second coolers
- Patent number 10,283,436
- Issue date May 7, 2019
- ABB Schweiz AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,192,800
- Issue date Jan 29, 2019
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 10,079,193
- Issue date Sep 18, 2018
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...
- Publication number 20240186199
- Publication date Jun 6, 2024
- David GUILLON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND E...
- Publication number 20240079279
- Publication date Mar 7, 2024
- Hitachi Energy Switzerland AG
- Slavo KICIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Module and Method for Producing a Power Module
- Publication number 20240030101
- Publication date Jan 25, 2024
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR MODULE, AND A ME...
- Publication number 20240014096
- Publication date Jan 11, 2024
- Hitachi Energy Switzerland AG
- Niko PAVLICEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT ARRANGEMENT, POWER SEMICONDUCTOR MODULE, METHOD...
- Publication number 20230343715
- Publication date Oct 26, 2023
- Hitachi Energy Switzerland AG
- Juergen SCHUDERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20230335472
- Publication date Oct 19, 2023
- Hitachi Energy Switzerland AG
- Juergen SCHUDERER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Free Configurable Power Semiconductor Module
- Publication number 20230116118
- Publication date Apr 13, 2023
- Hitachi Energy Switzerland AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Laser-Welded Leadframe
- Publication number 20220406745
- Publication date Dec 22, 2022
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement of a Power Semiconductor Module and a Cooler
- Publication number 20220254653
- Publication date Aug 11, 2022
- Hitachi Energy Switzerland AG
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module with Low Inductance Gate Crossing
- Publication number 20220238493
- Publication date Jul 28, 2022
- Hitachi Energy Switzerland AG
- Arne Schroeder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR POWER SWITCHES
- Publication number 20220166423
- Publication date May 26, 2022
- ABB Schweiz AG
- Giovanni Salvatore
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRIC POWER CONVERTER DEVICE WITH IMPROVED INTEGRATION OF COOLER...
- Publication number 20220142015
- Publication date May 5, 2022
- Audi AG
- Thomas GRADINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package with Highly Reliable Chip Topside
- Publication number 20210104449
- Publication date Apr 8, 2021
- ABB Power Grids Switzerland AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
- Publication number 20200350276
- Publication date Nov 5, 2020
- Audi AG
- Chunlei LUI
- B60 - VEHICLES IN GENERAL
Information Patent Application
HALF-BRIDGE MODULE WITH COAXIAL ARRANGEMENT OF THE DC TERMINALS
- Publication number 20200066686
- Publication date Feb 27, 2020
- ABB Schweiz AG
- Fabian Mohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN ENCAPSULATED POWER SEMICONDUCTOR MODULE WITH EXPOSED TERMINAL...
- Publication number 20200066609
- Publication date Feb 27, 2020
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING OF A POWER SEMICONDUCTOR MODULE
- Publication number 20190273040
- Publication date Sep 5, 2019
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE BASED ON MULTI-LAYER CIRCUIT BOARD
- Publication number 20180366400
- Publication date Dec 20, 2018
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180090401
- Publication date Mar 29, 2018
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20180090441
- Publication date Mar 29, 2018
- ABB Schweiz AG
- Felix Traub
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20180040538
- Publication date Feb 8, 2018
- ABB Schweiz AG
- Juergen Schuderer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20170263527
- Publication date Sep 14, 2017
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS

Fabian Mohn

Person

Patents Grantslast 30 patents

Arrangement of a power semiconductor module and a cooler

Power semiconductor module with low inductance gate crossing

Electric power converter device with improved integration of cooler...

Power semiconductor module with laser-welded leadframe

Power semiconductor package with highly reliable chip topside

Method for producing a semiconductor module by using adhesive attac...

Heat dissipation for power switches

Manufacturing of a power semiconductor module

Half-bridge module with coaxial arrangement of the DC terminals

Resin encapsulated power semiconductor module with exposed terminal...

Power module based on multi-layer circuit board

Power semiconductor module

Power electronics module with first and second coolers

Semiconductor device

Semiconductor module

Patents Applicationslast 30 patents

SEMICONDUCTOR POWER MODULE AND METHOD FOR MANUFACTURING A SEMICONDU...

POWER SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND E...

Power Module and Method for Producing a Power Module

POWER MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR MODULE, AND A ME...

ELECTRICAL CONTACT ARRANGEMENT, POWER SEMICONDUCTOR MODULE, METHOD...

POWER SEMICONDUCTOR MODULE

Free Configurable Power Semiconductor Module

Power Semiconductor Module with Laser-Welded Leadframe

Arrangement of a Power Semiconductor Module and a Cooler

Power Semiconductor Module with Low Inductance Gate Crossing

HEAT DISSIPATION FOR POWER SWITCHES

ELECTRIC POWER CONVERTER DEVICE WITH IMPROVED INTEGRATION OF COOLER...

Power Semiconductor Package with Highly Reliable Chip Topside

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE

HALF-BRIDGE MODULE WITH COAXIAL ARRANGEMENT OF THE DC TERMINALS

RESIN ENCAPSULATED POWER SEMICONDUCTOR MODULE WITH EXPOSED TERMINAL...

MANUFACTURING OF A POWER SEMICONDUCTOR MODULE

POWER MODULE BASED ON MULTI-LAYER CIRCUIT BOARD

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

POWER ELECTRONICS MODULE

SEMICONDUCTOR MODULE