Fabian Schnoy

Person

Tegernheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 11,776,882
- Issue date Oct 3, 2023
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating a semiconductor pac...
- Patent number 11,302,610
- Issue date Apr 12, 2022
- Infineon Technologies Austria AG
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly and method for mounting an electronic component to a subst...
- Patent number 11,211,304
- Issue date Dec 28, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective plating of semiconductor package leads
- Patent number 10,651,109
- Issue date May 12, 2020
- Infineon Technologies AG
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with improved thermal and electrical performance
- Patent number 10,373,897
- Issue date Aug 6, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bridging prevention structures for circuit boards and semico...
- Patent number 10,085,353
- Issue date Sep 25, 2018
- Infineon Technologies AG
- Carlo Baterna Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package comprising side wall marking
- Patent number 9,972,576
- Issue date May 15, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20220230941
- Publication date Jul 21, 2022
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Fabricating a Semiconductor Pac...
- Publication number 20200135619
- Publication date Apr 30, 2020
- Markus Dinkel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Plating of Semiconductor Package Leads
- Publication number 20200020607
- Publication date Jan 16, 2020
- Syahir Abd Hamid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly and Method for Mounting an Electronic Component to a Subst...
- Publication number 20190057923
- Publication date Feb 21, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Redirecting solder material to visually inspectable package surface
- Publication number 20170278762
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE
- Publication number 20170179009
- Publication date Jun 22, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package comprising side wall marking
- Publication number 20170148743
- Publication date May 25, 2017
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Bridging Prevention Structures for Circuit Boards and Semico...
- Publication number 20150131249
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Carlo Baterna Marbella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Fabian Schnoy

Person

Patents Grantslast 30 patents

Method of fabricating a semiconductor package

Semiconductor package and method of fabricating a semiconductor pac...

Assembly and method for mounting an electronic component to a subst...

Selective plating of semiconductor package leads

Semiconductor devices with improved thermal and electrical performance

Solder bridging prevention structures for circuit boards and semico...

Semiconductor chip package comprising side wall marking

Patents Applicationslast 30 patents

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

Semiconductor Package and Method of Fabricating a Semiconductor Pac...

Selective Plating of Semiconductor Package Leads

Assembly and Method for Mounting an Electronic Component to a Subst...

Redirecting solder material to visually inspectable package surface

SEMICONDUCTOR DEVICES WITH IMPROVED THERMAL AND ELECTRICAL PERFORMANCE

Semiconductor chip package comprising side wall marking

Solder Bridging Prevention Structures for Circuit Boards and Semico...