Fabien Quercia

Person

Saint Marcelin, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device comprising a transparent encapsulation structure...
- Patent number 12,288,961
- Issue date Apr 29, 2025
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with heat sink and manufacturing method...
- Patent number 12,278,155
- Issue date Apr 15, 2025
- STMicroelectronics (Grenoble 2) SAS
- Younes Boutaleb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip support device and corresponding manufacturing method
- Patent number 12,272,922
- Issue date Apr 8, 2025
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip support device and corresponding manufacturing method
- Patent number 11,916,353
- Issue date Feb 27, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics unit with integrated metallic pattern
- Patent number 11,817,377
- Issue date Nov 14, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 11,557,566
- Issue date Jan 17, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics unit with integrated metallic pattern
- Patent number 11,437,306
- Issue date Sep 6, 2022
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an electronic component mounted on a s...
- Patent number 10,897,822
- Issue date Jan 19, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 10,643,970
- Issue date May 5, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 10,224,306
- Issue date Mar 5, 2019
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire receiving pad
- Patent number 9,337,160
- Issue date May 10, 2016
- STMicroelectronics (Grenoble 2) SAS
- Damien Veychard
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...
- Publication number 20250218884
- Publication date Jul 3, 2025
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20250070081
- Publication date Feb 27, 2025
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20240146019
- Publication date May 2, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
- Publication number 20240038644
- Publication date Feb 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230318165
- Publication date Oct 5, 2023
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20230121780
- Publication date Apr 20, 2023
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING TOOL
- Publication number 20230081711
- Publication date Mar 16, 2023
- STMicroelectronics (Grenoble 2) SAS
- Didier CAMPOS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR
- Publication number 20230059627
- Publication date Feb 23, 2023
- STMicroelectronics (Grenoble 2) SAS
- Justin CATANIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
- Publication number 20220367330
- Publication date Nov 17, 2022
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...
- Publication number 20220157683
- Publication date May 19, 2022
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD
- Publication number 20210328403
- Publication date Oct 21, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING A TRANSPARENT ENCAPSULATION STRUCTURE...
- Publication number 20210320473
- Publication date Oct 14, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
- Publication number 20210242115
- Publication date Aug 5, 2021
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...
- Publication number 20200305283
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20200227382
- Publication date Jul 16, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING COMPONENT
- Publication number 20200196433
- Publication date Jun 18, 2020
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20190148334
- Publication date May 16, 2019
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...
- Publication number 20180122770
- Publication date May 3, 2018
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE RECEIVING PAD
- Publication number 20130001777
- Publication date Jan 3, 2013
- STMicroelectronics (Grenoble 2) SAS
- Damien Veychard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...
- Publication number 20110018135
- Publication date Jan 27, 2011
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS

Fabien Quercia

Person

Patents Grantslast 30 patents

Electronic device comprising a transparent encapsulation structure...

Integrated circuit package with heat sink and manufacturing method...

Electronic chip support device and corresponding manufacturing method

Method for forming an electrical connection between an electronic c...

Electronic chip support device and corresponding manufacturing method

Electronics unit with integrated metallic pattern

Method for forming an electrical connection between an electronic c...

Electronics unit with integrated metallic pattern

Electronic device comprising an electronic component mounted on a s...

Method for forming an electrical connection between an electronic c...

Method for forming an electrical connection between an electronic c...

Copper wire receiving pad

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD

ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN

ELECTRONIC DEVICE

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

WIRE BONDING TOOL

CONNECTOR

ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN

INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...

ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD

ELECTRONIC DEVICE COMPRISING A TRANSPARENT ENCAPSULATION STRUCTURE...

ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

METHOD FOR MOUNTING COMPONENT

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC C...

COPPER WIRE RECEIVING PAD

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...