Fabio Brucchi

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Reverse-blocking IGBT having a reverse-blocking edge termination st...
- Patent number 10,276,708
- Issue date Apr 30, 2019
- Infineon Technologies Austria AG
- Matteo Dainese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baseplate for an electronic module
- Patent number 10,109,544
- Issue date Oct 23, 2018
- Infineon Technologies AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 9,978,671
- Issue date May 22, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a reverse-blocking IGBT
- Patent number 9,741,570
- Issue date Aug 22, 2017
- Infineon Technologies Austria AG
- Matteo Dainese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing baseplate for an electronic module
- Patent number 9,716,018
- Issue date Jul 25, 2017
- Infineon Technologies AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, electronic system and method of manufacturing th...
- Patent number 9,648,776
- Issue date May 9, 2017
- Infineon Technologies Austria AG
- Fabio Brucchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Baseplate for an electronic module and method of manufacturing the...
- Patent number 9,305,874
- Issue date Apr 5, 2016
- Infineon Technologies AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 9,263,563
- Issue date Feb 16, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top-side insulation layer
- Patent number 9,099,391
- Issue date Aug 4, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of formation thereof
- Patent number 9,082,759
- Issue date Jul 14, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,815,647
- Issue date Aug 26, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor modules and methods of formation thereof
- Patent number 8,766,430
- Issue date Jul 1, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Thermal interface material having defined thermal, mechanical and e...
- Publication number 20210020541
- Publication date Jan 21, 2021
- Infineon Technologies Austria AG
- Christian KASZTELAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reverse-Blocking IGBT Having a Reverse-Blocking Edge Termination St...
- Publication number 20180033627
- Publication date Feb 1, 2018
- Infineon Technologies Austria AG
- Matteo Dainese
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Baseplate for an electronic module and method of manufacturing the...
- Publication number 20170287798
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Fabio BRUCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal interface material having defined thermal, mechanical and e...
- Publication number 20170117208
- Publication date Apr 27, 2017
- Infineon Technologies Austria AG
- Christian KASZTELAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Baseplate for an electronic module and method of manufacturing the...
- Publication number 20160196989
- Publication date Jul 7, 2016
- INFINEON TECHNOLOGIES AG
- Fabio BRUCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module, electronic system and method of manufacturing th...
- Publication number 20150327390
- Publication date Nov 12, 2015
- Infineon Technologies Austria AG
- Fabio BRUCCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Baseplate for an electronic module and method of manufacturing the...
- Publication number 20150294931
- Publication date Oct 15, 2015
- INFINEON TECHNOLOGIES AG
- Fabio BRUCCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20150270208
- Publication date Sep 24, 2015
- Infineon Technologies Austria AG
- Ralf OTREMBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package
- Publication number 20150115313
- Publication date Apr 30, 2015
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Top-Side Insulation Layer
- Publication number 20140264944
- Publication date Sep 18, 2014
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND CHIP PACKAGE
- Publication number 20140210061
- Publication date Jul 31, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Formation Thereof
- Publication number 20140145318
- Publication date May 29, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20130334677
- Publication date Dec 19, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Fabio Brucchi

Person

Patents Grantslast 30 patents

Reverse-blocking IGBT having a reverse-blocking edge termination st...

Baseplate for an electronic module

Power semiconductor device

Method of manufacturing a reverse-blocking IGBT

Method of manufacturing baseplate for an electronic module

Electronic module, electronic system and method of manufacturing th...

Baseplate for an electronic module and method of manufacturing the...

Semiconductor device package

Semiconductor package with top-side insulation layer

Semiconductor packages and methods of formation thereof

Chip package and a method for manufacturing a chip package

Semiconductor modules and methods of formation thereof

Patents Applicationslast 30 patents

Thermal interface material having defined thermal, mechanical and e...

Reverse-Blocking IGBT Having a Reverse-Blocking Edge Termination St...

Baseplate for an electronic module and method of manufacturing the...

Thermal interface material having defined thermal, mechanical and e...

Baseplate for an electronic module and method of manufacturing the...

Electronic module, electronic system and method of manufacturing th...

Baseplate for an electronic module and method of manufacturing the...

POWER SEMICONDUCTOR DEVICE

Semiconductor Device Package

Semiconductor Package with Top-Side Insulation Layer

CHIP ARRANGEMENT AND CHIP PACKAGE

Semiconductor Packages and Methods of Formation Thereof

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

Semiconductor Modules and Methods of Formation Thereof