Fan Chung Tseng

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Dual damascene copper process using a selected mask
- Patent number 8,685,853
- Issue date Apr 1, 2014
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fan Chung Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Dual damascence copper process using a selected mask
- Patent number 7,989,341
- Issue date Aug 2, 2011
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fan Chung Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Structure and method of forming a semiconductor material wafer
- Patent number 7,387,948
- Issue date Jun 17, 2008
- Grace Semiconductor Manufacturing Corporation
- Fan-Chi Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dual Damascene Copper Process Using a Selected Mask
- Publication number 20120108054
- Publication date May 3, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fan Chung Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Dual Damascene Copper Process Using a Selected Mask
- Publication number 20080020565
- Publication date Jan 24, 2008
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fan Chung Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Structure and method of forming a semiconductor material wafer
- Publication number 20070032093
- Publication date Feb 8, 2007
- Fan-Chi Tseng
- H01 - BASIC ELECTRIC ELEMENTS