Fan HU

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 12,215,016
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration scheme for breakdown voltage enhancement of a piezoelec...
- Patent number 11,984,261
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 11,834,325
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package comprising multi-depth trenches
- Patent number 11,667,522
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric anti-stiction structure for microelectromechanical sy...
- Patent number 11,365,115
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduction of electric field enhanced moisture penetration by metal...
- Patent number 11,289,568
- Issue date Mar 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device
- Patent number 11,220,422
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration scheme for breakdown voltage enhancement of a piezoelec...
- Patent number 11,107,630
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,961,118
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,899,608
- Issue date Jan 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-depth MEMS package
- Patent number 10,865,102
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming multi-depth MEMS package
- Patent number 10,752,495
- Issue date Aug 25, 2020
- Taiwan Semiconductor Maufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure with bilayer stopper and method for forming the same
- Patent number 10,618,801
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level integrated MEMS device enabled by silicon pillar and sm...
- Patent number 10,556,792
- Issue date Feb 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming multi-depth MEMS package
- Patent number 10,556,790
- Issue date Feb 11, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...
- Publication number 20240375943
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...
- Publication number 20240290541
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
- Publication number 20230399226
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...
- Publication number 20230382724
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20230373780
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE
- Publication number 20230331546
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- FAN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20220306452
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...
- Publication number 20210383972
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20210078858
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...
- Publication number 20210061641
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20200346923
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20200290863
- Publication date Sep 17, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- FAN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20200109046
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NOVEL INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIE...
- Publication number 20200098517
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Anderson Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20200024136
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20200024137
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCTION OF ELECTRIC FIELD ENHANCED MOISTURE PENETRATION BY METAL...
- Publication number 20200006469
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chi-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...
- Publication number 20190161346
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Chia Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE
- Publication number 20190161342
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chuan Tai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE WITH BILAYER STOPPER AND METHOD FOR FORMING THE SAME
- Publication number 20180127263
- Publication date May 10, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chuan TAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Piezoelectric anti-stiction structure for microelectromechanical sy...

Bonding structure and method thereof

Integration scheme for breakdown voltage enhancement of a piezoelec...

Piezoelectric anti-stiction structure for microelectromechanical sy...

MEMS package comprising multi-depth trenches

Piezoelectric anti-stiction structure for microelectromechanical sy...

Reduction of electric field enhanced moisture penetration by metal...

MEMS device

Integration scheme for breakdown voltage enhancement of a piezoelec...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Multi-depth MEMS package

Method for forming multi-depth MEMS package

MEMS structure with bilayer stopper and method for forming the same

Wafer level integrated MEMS device enabled by silicon pillar and sm...

Method for forming multi-depth MEMS package

Patents Applicationslast 30 patents

DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...

BONDING STRUCTURE AND METHOD THEREOF

INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER

DIELECTRIC PROTECTION LAYER CONFIGURED TO INCREASE PERFORMANCE OF M...

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

MEMS STRUCTURE

BONDING STRUCTURE AND METHOD THEREOF

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIEZOELEC...

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE

PIEZOELECTRIC ANTI-STICTION STRUCTURE FOR MICROELECTROMECHANICAL SY...

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE

MEMS DEVICE

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE

NOVEL INTEGRATION SCHEME FOR BREAKDOWN VOLTAGE ENHANCEMENT OF A PIE...

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

REDUCTION OF ELECTRIC FIELD ENHANCED MOISTURE PENETRATION BY METAL...

WAFER LEVEL INTEGRATED MEMS DEVICE ENABLED BY SILICON PILLAR AND SM...

METHOD FOR FORMING MULTI-DEPTH MEMS PACKAGE

MEMS STRUCTURE WITH BILAYER STOPPER AND METHOD FOR FORMING THE SAME