Fan Yeung

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Irvine, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatuses for integrated circuit substrate manufacture
- Patent number 8,779,598
- Issue date Jul 15, 2014
- Broadcom Corporation
- Fan Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip bump connection apparatus and method
- Patent number 8,378,471
- Issue date Feb 19, 2013
- ATI Technologies ULC
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip bump connection apparatus and method
- Patent number 7,670,939
- Issue date Mar 2, 2010
- ATI Technologies ULC
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
I/O connection scheme for QFN leadframe and package structures
- Patent number 7,646,083
- Issue date Jan 12, 2010
- Broadcom Corporation
- Fan Yeung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and Apparatuses for Integrated Circuit Substrate Manufacture
- Publication number 20130001791
- Publication date Jan 3, 2013
- BROADCOM CORPORATION
- Fan YEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BUMP CONNECTION APPARATUS AND METHOD
- Publication number 20100140798
- Publication date Jun 10, 2010
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Chip Bump Connection Apparatus and Method
- Publication number 20090278264
- Publication date Nov 12, 2009
- Roden R. Topacio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
I/O CONNECTION SCHEME FOR QFN LEADFRAME AND PACKAGE STRUCTURES
- Publication number 20090243054
- Publication date Oct 1, 2009
- BROADCOM CORPORATION
- Fan Yeung
- H01 - BASIC ELECTRIC ELEMENTS