Fang-Jia Liang

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,692
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component, semiconductor package and manufacturing method t...
- Patent number 11,682,619
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,515,274
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,374,303
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component, semiconductor package and manufacturing method t...
- Patent number 11,309,242
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semicondcutor package
- Patent number 11,233,019
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,094,642
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondcutor package and manufacturing method of semicondcutor pac...
- Patent number 10,720,399
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,629,539
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable logic block for designing an asynchronous circuit
- Patent number 7,307,450
- Issue date Dec 11, 2007
- Tatung Company
- Fang-Jia Liang
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234329
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260899
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20220246521
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20210407904
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20210375774
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210375809
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20200313278
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE
- Publication number 20200303331
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20200243454
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...
- Publication number 20200135669
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190139897
- Publication date May 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Programmable logic block for designing an asynchronous circuit
- Publication number 20060001445
- Publication date Jan 5, 2006
- Tatung Co., Ltd.
- Fang-Jia Liang
- H03 - BASIC ELECTRONIC CIRCUITRY

Fang-Jia Liang

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Package structure with improved antenna patterns performance

Package component, semiconductor package and manufacturing method t...

Semiconductor package and manufacturing method thereof

Package structure and method of fabricating the same

Package component, semiconductor package and manufacturing method t...

Manufacturing method of semicondcutor package

Package structure

Semicondcutor package and manufacturing method of semicondcutor pac...

Package structure and method of fabricating the same

Programmable logic block for designing an asynchronous circuit

Patents Applicationslast 30 patents

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE COMPONENT, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

PACKAGE COMPONENT, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE

PACKAGE STRUCTURE

SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDCUTOR PAC...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Programmable logic block for designing an asynchronous circuit