Farzaneh Yahyaei-Moayyed

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Capacitor design for controlling equivalent series resistance
- Patent number 7,212,395
- Issue date May 1, 2007
- Intel Corporation
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board housing clamp
- Patent number 6,975,518
- Issue date Dec 13, 2005
- Intel Corporation
- Kristopher Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabrication for a socket with embedded conductive structure
- Patent number 6,877,223
- Issue date Apr 12, 2005
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power/ground configuration for low impedance integrated circuit
- Patent number 6,784,532
- Issue date Aug 31, 2004
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for package socket with embedded power and ground...
- Patent number 6,584,685
- Issue date Jul 1, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit housing clamp and method of manufacture therefor
- Patent number 6,586,684
- Issue date Jul 1, 2003
- Intel Corporation
- Kristopher Frutschy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for package socket with embedded power and ground...
- Patent number 6,558,181
- Issue date May 6, 2003
- Intel Corporation
- Chee-Yee Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket with embedded conductive structure and method of fabrication...
- Patent number 6,428,358
- Issue date Aug 6, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY
- Publication number 20210183846
- Publication date Jun 17, 2021
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor design for controlling equivalent series resistance
- Publication number 20060139847
- Publication date Jun 29, 2006
- Yuan-Liang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power/ground configuration for low impedance integrated circuit
- Publication number 20040021215
- Publication date Feb 5, 2004
- Intel Corporation
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit housing clamp and method of manufacture therefor
- Publication number 20030000739
- Publication date Jan 2, 2003
- Intel Corporation
- Kristopher Frutschy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabrication for a socket with embedded conductive structure
- Publication number 20020151218
- Publication date Oct 17, 2002
- Intel Corporation
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for pakage socket with embedded power and ground...
- Publication number 20020115330
- Publication date Aug 22, 2002
- Chee-Yee Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
System and method for package socket with embedded power and ground...
- Publication number 20020115313
- Publication date Aug 22, 2002
- Chee-Yee Chung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SOCKET WITH EMBEDDED CONDUCTIVE STRUCTURE
- Publication number 20020086568
- Publication date Jul 4, 2002
- David G. Figueroa
- H01 - BASIC ELECTRIC ELEMENTS

Farzaneh Yahyaei-Moayyed

Person

Patents Grantslast 30 patents

Capacitor design for controlling equivalent series resistance

Printed circuit board housing clamp

Method of fabrication for a socket with embedded conductive structure

Power/ground configuration for low impedance integrated circuit

System and method for package socket with embedded power and ground...

Circuit housing clamp and method of manufacture therefor

System and method for package socket with embedded power and ground...

Socket with embedded conductive structure and method of fabrication...

Patents Applicationslast 30 patents

ENHANCED INTEGRATED CIRCUIT COMPONENT POWER DELIVERY

Capacitor design for controlling equivalent series resistance

Power/ground configuration for low impedance integrated circuit

Circuit housing clamp and method of manufacture therefor

Method of fabrication for a socket with embedded conductive structure

System and method for pakage socket with embedded power and ground...

System and method for package socket with embedded power and ground...

SOCKET WITH EMBEDDED CONDUCTIVE STRUCTURE