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Farzin NAJAFI

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  • Ottawa, CA
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Patents Applicationslast 30 patents

  • Information Patent Application

    LEADED PACKAGE USING ROUTING LAYER FOR INTEGRATED CIRCUIT DIE
    • Publication number 20250140665
    • Publication date May 1, 2025
    • Infineon Technologies Canada Inc.
    • Mihalis MICHAEL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-DIE PACKAGE
    • Publication number 20250140674
    • Publication date May 1, 2025
    • Infineon Technologies Canada Inc.
    • Marco A. ZUNIGA
    • H01 - BASIC ELECTRIC ELEMENTS