Fatima Lina Ayatollahi

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,475,733
- Issue date Nov 12, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 10,103,094
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for heat dissipating interposers
- Patent number 9,685,401
- Issue date Jun 20, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modified TSV structure and methods thereof
- Patent number 9,312,175
- Issue date Apr 12, 2016
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for heat dissipating interposers
- Patent number 9,123,780
- Issue date Sep 1, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20190139878
- Publication date May 9, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20170365546
- Publication date Dec 21, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20150340310
- Publication date Nov 26, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFIED TSV STRUCTURE AND METHODS THEREOF
- Publication number 20140175654
- Publication date Jun 26, 2014
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS
- Publication number 20140167267
- Publication date Jun 19, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS