Fay HUA

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device with out-plane inductors
- Patent number 11,282,633
- Issue date Mar 22, 2022
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for die stacking and associated configurations
- Patent number 11,222,863
- Issue date Jan 11, 2022
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on package architecture including structures on die back side
- Patent number 10,777,538
- Issue date Sep 15, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with components formed by late binding using sel...
- Patent number 10,734,236
- Issue date Aug 4, 2020
- Intel Corporation
- Sasha N. Oster
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Sam assisted selective e-less plating on packaging materials
- Patent number 10,697,065
- Issue date Jun 30, 2020
- Intel Corporation
- Fay Hua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Non-planar on-package via capacitor
- Patent number 10,595,410
- Issue date Mar 17, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder contacts for socket assemblies
- Patent number 10,321,573
- Issue date Jun 11, 2019
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices with components formed by late binding using sel...
- Patent number 10,304,686
- Issue date May 28, 2019
- Intel Corporation
- Sasha N. Oster
- B82 - NANO-TECHNOLOGY
Information Patent Grant
System on package architecture including structures on die back side
- Patent number 10,304,804
- Issue date May 28, 2019
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder contacts for socket assemblies
- Patent number 9,860,988
- Issue date Jan 2, 2018
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local dense patch for board assembly utilizing laser structuring me...
- Patent number 9,824,962
- Issue date Nov 21, 2017
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to minimize thermal impedance using copper on die backside
- Patent number 9,406,582
- Issue date Aug 2, 2016
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant and compliant wire interconnects, nano-s...
- Patent number 8,441,118
- Issue date May 14, 2013
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite solder TIM for electronic package
- Patent number 8,242,602
- Issue date Aug 14, 2012
- Intel Corporation
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball-limiting metallurgies, solder bump compositions used therewith...
- Patent number 7,960,831
- Issue date Jun 14, 2011
- Intel Corporation
- Fay Hua
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermal interface material with carbon nanotubes and particles
- Patent number 7,886,813
- Issue date Feb 15, 2011
- Intel Corporation
- Fay Hua
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Composite solder TIM for electronic package
- Patent number 7,816,250
- Issue date Oct 19, 2010
- Intel Corporation
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for compensating for CTE mismatch using phase change lead-fr...
- Patent number 7,776,651
- Issue date Aug 17, 2010
- Intel Corporation
- Fay Hua
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies with hot spot cooling and methods relating th...
- Patent number 7,704,798
- Issue date Apr 27, 2010
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant and compliant wire interconnects, nano-s...
- Patent number 7,615,476
- Issue date Nov 10, 2009
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder metallurgy and process for packaging applica...
- Patent number 7,560,373
- Issue date Jul 14, 2009
- Fay Hua
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect shunt used for current distribution and reliability re...
- Patent number 7,524,754
- Issue date Apr 28, 2009
- Intel Corporation
- Mark Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano-sized metals and alloys, and methods of assembling packages co...
- Patent number 7,524,351
- Issue date Apr 28, 2009
- Intel Corporation
- Fay Hua
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with hot spot cooling
- Patent number 7,489,033
- Issue date Feb 10, 2009
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to minimize thermal impedance using copper on die backside
- Patent number 7,449,780
- Issue date Nov 11, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary underflow integral heat spreader
- Patent number 7,439,617
- Issue date Oct 21, 2008
- Intel Corporation
- Carl Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive solder material
- Patent number 7,436,058
- Issue date Oct 14, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping copper bumps
- Patent number 7,391,112
- Issue date Jun 24, 2008
- Intel Corporation
- Jianxing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly having an indium wetting layer on a thermally c...
- Patent number 7,362,580
- Issue date Apr 22, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball-limiting metallurgies, solder bump compositions used therewith...
- Patent number 7,314,819
- Issue date Jan 1, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES FOR DIE STACKING AND ASSOCIATED CONFIGURATIONS
- Publication number 20210193613
- Publication date Jun 24, 2021
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH OUT-PLANE INDUCTORS
- Publication number 20200082969
- Publication date Mar 12, 2020
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM ON PACKAGE ARCHITECTURE INCLUDING STRUCTURES ON DIE BACK SIDE
- Publication number 20190326258
- Publication date Oct 24, 2019
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH COMPONENTS FORMED BY LATE BINDING USING SEL...
- Publication number 20190259622
- Publication date Aug 22, 2019
- Intel Corporation
- Sasha N. OSTER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAM ASSISTED SELECTIVE E-LESS PLATING ON PACKAGING MATERIALS
- Publication number 20180305818
- Publication date Oct 25, 2018
- Intel Corporation
- Fay HUA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM ON PACKAGE ARCHITECTURE INCLUDING STRUCTURES ON DIE BACK SIDE
- Publication number 20180286834
- Publication date Oct 4, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH COMPONENTS FORMED BY LATE BINDING USING SEL...
- Publication number 20180286687
- Publication date Oct 4, 2018
- Intel Corporation
- Sasha N. OSTER
- B82 - NANO-TECHNOLOGY
Information Patent Application
WEARABLE DEVICE PLATFORM APPARATUS AND METHOD
- Publication number 20180233710
- Publication date Aug 16, 2018
- Fay Hua
- A44 - HABERDASHERY JEWELLERY
Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20180192519
- Publication date Jul 5, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY PACKAGE ON PACKAGE DEVICES CREATED THROUGH A SELF ASSE...
- Publication number 20180096975
- Publication date Apr 5, 2018
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-PLANAR ON-PACKAGE VIA CAPACITOR
- Publication number 20180098428
- Publication date Apr 5, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZN DOPED SOLDERS ON CU SURFACE FINISH FOR THIN FLI APPLICATION
- Publication number 20180047689
- Publication date Feb 15, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SAM ASSISTED SELECTIVE E-LESS PLATING ON PACKAGING MATERIALS
- Publication number 20170154790
- Publication date Jun 1, 2017
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE ON SUBSTRATE PACKAGE
- Publication number 20170053858
- Publication date Feb 23, 2017
- Intel Corporation
- Jan Krajniak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER CONTACTS FOR SOCKET ASSEMBLIES
- Publication number 20160338199
- Publication date Nov 17, 2016
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE
- Publication number 20100259890
- Publication date Oct 14, 2010
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electromigration-resistant and compliant wire interconnects, nano-s...
- Publication number 20100047971
- Publication date Feb 25, 2010
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES WITH HOT SPOT COOLING AND METHODS RELATING TH...
- Publication number 20090093072
- Publication date Apr 9, 2009
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS TO MINIMIZE THERMAL IMPEDANCE USING COPPER ON DIE BACKSIDE
- Publication number 20080296754
- Publication date Dec 4, 2008
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reactive solder material
- Publication number 20080293188
- Publication date Nov 27, 2008
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...
- Publication number 20080153210
- Publication date Jun 26, 2008
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY WITH HOT SPOT COOLING
- Publication number 20080111234
- Publication date May 15, 2008
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite solder TIM for electronic package
- Publication number 20080090405
- Publication date Apr 17, 2008
- Tom Fitzgerald
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capillary underflow integral heat spreader
- Publication number 20080017975
- Publication date Jan 24, 2008
- Carl Deppisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compliant conductive interconnects
- Publication number 20070297151
- Publication date Dec 27, 2007
- Larry E. Mosley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL-LIMITING METALLURGIES, SOLDER BUMP COMPOSITIONS USED THEREWITH...
- Publication number 20070284741
- Publication date Dec 13, 2007
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HE...
- Publication number 20070020813
- Publication date Jan 25, 2007
- Intel Corporation
- Thomas J. Fitzgerald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromigration-resistant and compliant wire interconnects, nano-s...
- Publication number 20070001280
- Publication date Jan 4, 2007
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball-limiting metallurgies, solder bump compositions used therewith...
- Publication number 20070004086
- Publication date Jan 4, 2007
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal interface material and method
- Publication number 20070001310
- Publication date Jan 4, 2007
- Fay Hua
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Device with out-plane inductors

Techniques for die stacking and associated configurations

System on package architecture including structures on die back side

Electronic devices with components formed by late binding using sel...

Sam assisted selective e-less plating on packaging materials

Non-planar on-package via capacitor

Solder contacts for socket assemblies

Electronic devices with components formed by late binding using sel...

System on package architecture including structures on die back side

Solder contacts for socket assemblies

Local dense patch for board assembly utilizing laser structuring me...

Apparatus to minimize thermal impedance using copper on die backside

Electromigration-resistant and compliant wire interconnects, nano-s...

Composite solder TIM for electronic package

Ball-limiting metallurgies, solder bump compositions used therewith...

Thermal interface material with carbon nanotubes and particles

Composite solder TIM for electronic package

Method for compensating for CTE mismatch using phase change lead-fr...

Electronic assemblies with hot spot cooling and methods relating th...

Electromigration-resistant and compliant wire interconnects, nano-s...

Low temperature solder metallurgy and process for packaging applica...

Interconnect shunt used for current distribution and reliability re...

Nano-sized metals and alloys, and methods of assembling packages co...

Electronic assembly with hot spot cooling

Apparatus to minimize thermal impedance using copper on die backside

Capillary underflow integral heat spreader

Reactive solder material

Capping copper bumps

Electronic assembly having an indium wetting layer on a thermally c...

Ball-limiting metallurgies, solder bump compositions used therewith...

Patents Applicationslast 30 patents

TECHNIQUES FOR DIE STACKING AND ASSOCIATED CONFIGURATIONS

DEVICE WITH OUT-PLANE INDUCTORS

SYSTEM ON PACKAGE ARCHITECTURE INCLUDING STRUCTURES ON DIE BACK SIDE

ELECTRONIC DEVICES WITH COMPONENTS FORMED BY LATE BINDING USING SEL...

SAM ASSISTED SELECTIVE E-LESS PLATING ON PACKAGING MATERIALS

SYSTEM ON PACKAGE ARCHITECTURE INCLUDING STRUCTURES ON DIE BACK SIDE

ELECTRONIC DEVICES WITH COMPONENTS FORMED BY LATE BINDING USING SEL...

WEARABLE DEVICE PLATFORM APPARATUS AND METHOD

SOLDER CONTACTS FOR SOCKET ASSEMBLIES

HIGH DENSITY PACKAGE ON PACKAGE DEVICES CREATED THROUGH A SELF ASSE...

NON-PLANAR ON-PACKAGE VIA CAPACITOR

ZN DOPED SOLDERS ON CU SURFACE FINISH FOR THIN FLI APPLICATION

SAM ASSISTED SELECTIVE E-LESS PLATING ON PACKAGING MATERIALS

SUBSTRATE ON SUBSTRATE PACKAGE

SOLDER CONTACTS FOR SOCKET ASSEMBLIES

COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE

Electromigration-resistant and compliant wire interconnects, nano-s...

ELECTRONIC ASSEMBLIES WITH HOT SPOT COOLING AND METHODS RELATING TH...

APPARATUS TO MINIMIZE THERMAL IMPEDANCE USING COPPER ON DIE BACKSIDE

Reactive solder material

ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY C...

ELECTRONIC ASSEMBLY WITH HOT SPOT COOLING

Composite solder TIM for electronic package

Capillary underflow integral heat spreader

Compliant conductive interconnects

BALL-LIMITING METALLURGIES, SOLDER BUMP COMPOSITIONS USED THEREWITH...

DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HE...

Electromigration-resistant and compliant wire interconnects, nano-s...

Ball-limiting metallurgies, solder bump compositions used therewith...

Thermal interface material and method