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Chengdu, CN
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last 30 patents
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Patent Grant
Semiconductor device having conductive bump with improved reliability
Patent number
9,768,135
Issue date
Sep 19, 2017
Monolithic Power Systems, Inc.
Ze-Qiang Yao
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBU...
Publication number
20180174992
Publication date
Jun 21, 2018
Chengdu Monolithic Power Systems Co., Ltd.
Fayou Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYER WITH COPPER MIGRAT...
Publication number
20180019199
Publication date
Jan 18, 2018
Chengdu Monolithic Power Systems Co., Ltd.
Ming Xiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE BUMP WITH IMPROVED RELIABILITY
Publication number
20170179059
Publication date
Jun 22, 2017
Monolithic Power Systems, Inc.
Ze-Qiang Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ESD PROTECTION STRUCTURE AND ASSOCIATED...
Publication number
20140103416
Publication date
Apr 17, 2014
Chengdu Monolithic Power Systems Co., Ltd.
Rongyao Ma
H01 - BASIC ELECTRIC ELEMENTS