Fei Guo

Person

Richmond Hill, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Anti-resonance structure for dampening die package resonance
- Patent number 11,848,656
- Issue date Dec 19, 2023
- ATI Technologies ULC
- Fei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-based damping resistor
- Patent number 10,985,097
- Issue date Apr 20, 2021
- Advanced Micro Devices, Inc.
- Fei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density cross link die with polymer routing layer
- Patent number 10,923,430
- Issue date Feb 16, 2021
- Advanced Micro Devices, Inc.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-resonance structure for dampening die package resonance
- Patent number 10,355,661
- Issue date Jul 16, 2019
- Advanced Micro Devices, Inc.
- Fei Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Data transmission with power supply noise compensation
- Patent number 10,230,370
- Issue date Mar 12, 2019
- ATI Technologies ULC
- Fei Guo
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of manufacturing interposer-based damping resistor
- Patent number 10,074,600
- Issue date Sep 11, 2018
- ATI Technologies ULC
- Fei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for noise reduction in multi-frequency clocking e...
- Patent number 9,720,486
- Issue date Aug 1, 2017
- Advanced Micro Devices, Inc.
- Angel E. Socarras
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High bandwidth passive switching current sensor
- Patent number 8,618,814
- Issue date Dec 31, 2013
- ATI Technologies ULC
- Fei Guo
- G01 - MEASURING TESTING
Information Patent Grant
Under bump metallization for on-die capacitor
- Patent number 8,314,474
- Issue date Nov 20, 2012
- ATI Technologies ULC
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wave guiding structures for crosstalk reduction
- Patent number 8,203,395
- Issue date Jun 19, 2012
- ATI Technologies ULC
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKING POWER DELIVERY DEVICE DIES
- Publication number 20230207546
- Publication date Jun 29, 2023
- ADVANCED MICRO DEVICES, INC.
- ARSALAN ALAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-RESONANCE STRUCTURE FOR DAMPENING DIE PACKAGE RESONANCE
- Publication number 20220416750
- Publication date Dec 29, 2022
- ATI Technologies ULC
- Fei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER-BASED DAMPING RESISTOR
- Publication number 20180337119
- Publication date Nov 22, 2018
- ATI Technologies ULC
- Fei Guo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
DATA TRANSMISSION WITH POWER SUPPLY NOISE COMPENSATION
- Publication number 20180309448
- Publication date Oct 25, 2018
- ATI Technologies ULC
- Fei Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD AND DEVICE FOR NOISE REDUCTION IN MULTI-FREQUENCY CLOCKING E...
- Publication number 20170090542
- Publication date Mar 30, 2017
- Advanced Micro Devices, Inc.
- Angel E. Socarras
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER-BASED DAMPING RESISTOR
- Publication number 20130258627
- Publication date Oct 3, 2013
- Fei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Bandwidth Passive Switching Current Sensor
- Publication number 20120200303
- Publication date Aug 9, 2012
- Fei Guo
- G01 - MEASURING TESTING
Information Patent Application
Wave Guiding Structures for Crosstalk Reduction
- Publication number 20110037528
- Publication date Feb 17, 2011
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Under Bump Metallization for On-Die Capacitor
- Publication number 20100019347
- Publication date Jan 28, 2010
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Anti-resonance structure for dampening die package resonance

Interposer-based damping resistor

High density cross link die with polymer routing layer

Anti-resonance structure for dampening die package resonance

Data transmission with power supply noise compensation

Method of manufacturing interposer-based damping resistor

Method and device for noise reduction in multi-frequency clocking e...

High bandwidth passive switching current sensor

Under bump metallization for on-die capacitor

Wave guiding structures for crosstalk reduction

Patents Applicationslast 30 patents

STACKING POWER DELIVERY DEVICE DIES

ANTI-RESONANCE STRUCTURE FOR DAMPENING DIE PACKAGE RESONANCE

INTERPOSER-BASED DAMPING RESISTOR

DATA TRANSMISSION WITH POWER SUPPLY NOISE COMPENSATION

METHOD AND DEVICE FOR NOISE REDUCTION IN MULTI-FREQUENCY CLOCKING E...

INTERPOSER-BASED DAMPING RESISTOR

High Bandwidth Passive Switching Current Sensor

Wave Guiding Structures for Crosstalk Reduction

Under Bump Metallization for On-Die Capacitor