Fei-Jain Wu

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,651,974
- Issue date May 16, 2023
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible substrate
- Patent number 9,961,759
- Issue date May 1, 2018
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate
- Patent number 9,510,441
- Issue date Nov 29, 2016
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with bump structure and manufacturing method thereof
- Patent number 9,177,830
- Issue date Nov 3, 2015
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336233
- Publication date Oct 20, 2022
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220037166
- Publication date Feb 3, 2022
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SUBSTRATE
- Publication number 20170019984
- Publication date Jan 19, 2017
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE
- Publication number 20160234927
- Publication date Aug 11, 2016
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF
- Publication number 20140217578
- Publication date Aug 7, 2014
- Chipbond Technology Corporation
- Lung-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallized surface wafer level package structure
- Publication number 20020180064
- Publication date Dec 5, 2002
- Chipbond Technology Corporation
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS

Fei-Jain Wu

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Flexible substrate

Flexible substrate

Substrate with bump structure and manufacturing method thereof

Patents Applicationslast 30 patents

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

FLEXIBLE SUBSTRATE

FLEXIBLE SUBSTRATE

SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF

Metallized surface wafer level package structure