FEI-LUNG LAI

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NEW TAIPEI CITY, TW

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Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 12,151,932
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 11,814,283
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,713,242
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of using integrated electro-microfluidic probe card
- Patent number 11,703,475
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Shao Liu
- G01 - MEASURING TESTING
Information Patent Grant
MEMS apparatus with anti-stiction layer
- Patent number 11,542,151
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor manufacturing method and structure thereof
- Patent number 11,254,564
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with dummy-area utilization for pressure enhancement
- Patent number 11,174,158
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 11,148,936
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Backside CMOS compatible BioFET with no plasma induced damage
- Patent number 11,099,152
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bypass structure
- Patent number 11,084,713
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device having a mechanically robust...
- Patent number 11,040,870
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fluid deposition apparatus and method
- Patent number 11,027,310
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Wen Cheng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of fabricating a biological field-effect transistor (BioFET)...
- Patent number 10,823,696
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Method of stiction prevention by patterned anti-stiction layer
- Patent number 10,745,268
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of stiction prevention by patterned anti-stiction layer
- Patent number 10,654,707
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bypass structure
- Patent number 10,640,366
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of semiconductor structure including heater
- Patent number 10,618,804
- Issue date Apr 14, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 10,508,027
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Backside CMOS compatible BioFET with no plasma induced damage
- Patent number 10,473,616
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using integrated electro-microfluidic probe card
- Patent number 10,429,341
- Issue date Oct 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Shao Liu
- G01 - MEASURING TESTING
Information Patent Grant
Backside sensing BioFET with enhanced performance
- Patent number 10,184,912
- Issue date Jan 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Fluid deposition appartus and method
- Patent number 10,155,244
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Amplified dual-gate bio field effect transistor
- Patent number 10,094,801
- Issue date Oct 9, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Shao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS-MEMS structure and method of forming the same
- Patent number 10,046,965
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,035,700
- Issue date Jul 31, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Backside sensing BioFET with enhanced performance
- Patent number 9,976,982
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Integrated biosensor
- Patent number 9,933,388
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside CMOS compatible BioFET with no plasma induced damage
- Patent number 9,709,525
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplified dual-gate bio field effect transistor
- Patent number 9,689,835
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor sensing structure
- Patent number 9,630,831
- Issue date Apr 25, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jung-Huei Peng
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING
- Publication number 20240409395
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20230382712
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT
- Publication number 20220063994
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BYPASS STRUCTURE
- Publication number 20210354980
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20210309508
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BIOFET WITH INCREASED SENSING AREA
- Publication number 20210072181
- Publication date Mar 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...
- Publication number 20210024348
- Publication date Jan 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS APPARATUS WITH ANTI-STICTION LAYER
- Publication number 20200346919
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BYPASS STRUCTURE
- Publication number 20200239298
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF
- Publication number 20200231431
- Publication date Jul 23, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200140266
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT
- Publication number 20200131032
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BYPASS STRUCTURE
- Publication number 20200102212
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Eason Hsieh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Backside CMOS Compatible BioFET with No Plasma Induced Damage
- Publication number 20200072789
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shao LIU
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF USING INTEGRATED ELECTRO-MICROFLUIDIC PROBE CARD
- Publication number 20200025713
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shao LIU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER
- Publication number 20200024124
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER
- Publication number 20190002273
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180362335
- Publication date Dec 20, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD
- Publication number 20180346319
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BioFET With Increased Sensing Area
- Publication number 20180313783
- Publication date Nov 1, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen CHENG
- G01 - MEASURING TESTING
Information Patent Application
Backside Sensing BioFET with Enhanced Performance
- Publication number 20180238827
- Publication date Aug 23, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Wen CHENG
- G01 - MEASURING TESTING
Information Patent Application
Backside CMOS Compatible BioFET With No Plasma Induced Damage
- Publication number 20170315085
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Shao LIU
- G01 - MEASURING TESTING
Information Patent Application
CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20170183222
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170129771
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SENSING STRUCTURE
- Publication number 20170107099
- Publication date Apr 20, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- JUNG-HUEI PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fluid Deposition Apparatus and Method
- Publication number 20170065958
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170066646
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF USING INTEGRATED ELECTRO-MICROFLUIDIC PROBE CARD
- Publication number 20170059515
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Shao LIU
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED BIOSENSOR
- Publication number 20170016851
- Publication date Jan 19, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Chun-Wen Cheng
- G01 - MEASURING TESTING
Information Patent Application
Backside Sensing BioFET with Enhanced Performance
- Publication number 20160320337
- Publication date Nov 3, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- G01 - MEASURING TESTING

FEI-LUNG LAI

Person

Patents Grantslast 30 patents

Microelectromechanical systems device having a mechanically robust...

Microelectromechanical systems device having a mechanically robust...

MEMS device with dummy-area utilization for pressure enhancement

Method of using integrated electro-microfluidic probe card

MEMS apparatus with anti-stiction layer

Semiconductor manufacturing method and structure thereof

MEMS device with dummy-area utilization for pressure enhancement

CMOS-MEMS structure and method of forming the same

Backside CMOS compatible BioFET with no plasma induced damage

Bypass structure

Microelectromechanical systems device having a mechanically robust...

Fluid deposition apparatus and method

Method of fabricating a biological field-effect transistor (BioFET)...

Method of stiction prevention by patterned anti-stiction layer

Method of stiction prevention by patterned anti-stiction layer

Bypass structure

Manufacturing method of semiconductor structure including heater

CMOS-MEMS structure and method of forming the same

Backside CMOS compatible BioFET with no plasma induced damage

Method of using integrated electro-microfluidic probe card

Backside sensing BioFET with enhanced performance

Fluid deposition appartus and method

Amplified dual-gate bio field effect transistor

CMOS-MEMS structure and method of forming the same

Semiconductor structure and manufacturing method thereof

Backside sensing BioFET with enhanced performance

Integrated biosensor

Backside CMOS compatible BioFET with no plasma induced damage

Amplified dual-gate bio field effect transistor

Semiconductor sensing structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MAKING

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

BYPASS STRUCTURE

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...

BIOFET WITH INCREASED SENSING AREA

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING A MECHANICALLY ROBUST...

MEMS APPARATUS WITH ANTI-STICTION LAYER

BYPASS STRUCTURE

SEMICONDUCTOR MANUFACTURING METHOD AND STRUCTURE THEREOF

CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

MEMS DEVICE WITH DUMMY-AREA UTILIZATION FOR PRESSURE ENHANCEMENT

BYPASS STRUCTURE

Backside CMOS Compatible BioFET with No Plasma Induced Damage

METHOD OF USING INTEGRATED ELECTRO-MICROFLUIDIC PROBE CARD

METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER

METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER

CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR MANUFACTURING METHOD

BioFET With Increased Sensing Area

Backside Sensing BioFET with Enhanced Performance

Backside CMOS Compatible BioFET With No Plasma Induced Damage

CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR SENSING STRUCTURE

Fluid Deposition Apparatus and Method

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF USING INTEGRATED ELECTRO-MICROFLUIDIC PROBE CARD

INTEGRATED BIOSENSOR

Backside Sensing BioFET with Enhanced Performance