Fei Wu

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Process chamber with reduced plasma arc
- Patent number 11,875,969
- Issue date Jan 16, 2024
- Applied Materials, Inc.
- Fei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature electrostatic chuck
- Patent number 11,133,212
- Issue date Sep 28, 2021
- Applied Materials, Inc.
- Abdul Aziz Khaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line pair based full field sharpness test
- Patent number 9,307,230
- Issue date Apr 5, 2016
- Apple Inc.
- Fei Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD OF CLEANING PROCESS CHAMBERS USING PLASMA
- Publication number 20220098729
- Publication date Mar 31, 2022
- Applied Materials, Inc.
- Fei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS CHAMBER WITH REDUCED PLASMA ARC
- Publication number 20200365370
- Publication date Nov 19, 2020
- Applied Materials, Inc.
- Fei WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE ELECTROSTATIC CHUCK
- Publication number 20190355608
- Publication date Nov 21, 2019
- Applied Materials, Inc.
- Abdul Aziz KHAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE PAIR BASED FULL FIELD SHARPNESS TEST
- Publication number 20140002673
- Publication date Jan 2, 2014
- Apple Inc.
- Fei Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FULL FIELD SHARPNESS TEST
- Publication number 20130083205
- Publication date Apr 4, 2013
- Mark N. Gamadia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE