Fei Zong

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Exposed die power semiconductor device
- Patent number 9,613,941
- Issue date Apr 4, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having side and bottom contact pads
- Patent number 9,362,212
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device grid array package
- Patent number 9,252,114
- Issue date Feb 2, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with pre-molded die
- Patent number 9,214,413
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for monitoring free air ball (FAB) formation i...
- Patent number 8,496,158
- Issue date Jul 30, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Fei Zong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EXPOSED DIE POWER SEMICONDUCTOR DEVICE
- Publication number 20150255443
- Publication date Sep 10, 2015
- Yanbo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE
- Publication number 20150243623
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE
- Publication number 20150243586
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE METALLIZATION PATTERNS FOR INTEGRATED CIRCUITS
- Publication number 20150235969
- Publication date Aug 20, 2015
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING MACHINE AND METHOD FOR TESTING WIRE BOND CONNECTIONS
- Publication number 20140103096
- Publication date Apr 17, 2014
- Hanmin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MONITORING FREE AIR BALL (FAB) FORMATION I...
- Publication number 20130119114
- Publication date May 16, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Fei ZONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR