TREA

Feibiao CHEN

Follow

Person

  • Shanghai, CN
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR MANUFACTURING APPARATUS
    • Publication number 20200273730
    • Publication date Aug 27, 2020
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Feibiao CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP BONDING APPARATUS AND BONDING METHOD
    • Publication number 20200144218
    • Publication date May 7, 2020
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Tianming WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNIVERSAL CHIP BATCH-BONDING APPARATUS AND METHOD
    • Publication number 20200013647
    • Publication date Jan 9, 2020
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Song GUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP BONDING DEVICE AND BONDING METHOD
    • Publication number 20200013656
    • Publication date Jan 9, 2020
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO.,LTD.
    • Feibiao CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BATCH BONDING APPARATUS AND BONDING METHOD
    • Publication number 20190385972
    • Publication date Dec 19, 2019
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Xiaoyu JIANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP BONDING DEVICE
    • Publication number 20190378741
    • Publication date Dec 12, 2019
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Feibiao CHEN
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    FOCUSING AND LEVELING MEASUREMENT DEVICE AND METHOD
    • Publication number 20190302582
    • Publication date Oct 3, 2019
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Qi CHENG
    • G01 - MEASURING TESTING
  • Information Patent Application

    A CHIP BONDING DEVICE AND BONDING METHOD THEREOF
    • Publication number 20190164930
    • Publication date May 30, 2019
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Song GUO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP BONDING APPARATUS AND METHOD
    • Publication number 20190088516
    • Publication date Mar 21, 2019
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Yuebin ZHU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ADAPTIVE GROOVE FOCUSING AND LEVELING DEVICE AND METHOD
    • Publication number 20170351185
    • Publication date Dec 7, 2017
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
    • Jingchao QI
    • G01 - MEASURING TESTING
  • Information Patent Application

    EXPOSURE DEVICE AND OUT-OF-FOCUS AND TILT ERROR COMPENSATION METHOD
    • Publication number 20170219935
    • Publication date Aug 3, 2017
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT Co., LTD.
    • Feibiao CHEN
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    FOCUSING LEVELING DEVICE
    • Publication number 20160327875
    • Publication date Nov 10, 2016
    • SHANGHAI MICRO ELECTRONICS EQUIPMENT Co., LTD.
    • Haijun SONG
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY