FEIYUE MA

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming a metal gapfill
- Patent number 11,355,391
- Issue date Jun 7, 2022
- Applied Materials, Inc.
- Xi Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,727,119
- Issue date Jul 28, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ pre-clean for selectivity improvement for selective deposition
- Patent number 10,395,916
- Issue date Aug 27, 2019
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,256,144
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming low-resistance contacts through integrated proc...
- Patent number 9,947,578
- Issue date Apr 17, 2018
- Applied Materials, Inc.
- Yu Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A METAL GAPFILL
- Publication number 20200303250
- Publication date Sep 24, 2020
- Applied Materials, Inc.
- Xi CEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
- Publication number 20190385838
- Publication date Dec 19, 2019
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL
- Publication number 20190157145
- Publication date May 23, 2019
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL
- Publication number 20180315650
- Publication date Nov 1, 2018
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods To Selectively Deposit Corrosion-Free Metal Contacts
- Publication number 20180145034
- Publication date May 24, 2018
- Applied Materials, Inc.
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromigration Improvement Using Tungsten For Selective Cobalt De...
- Publication number 20180144973
- Publication date May 24, 2018
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition
- Publication number 20180076020
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Kai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING LOW-RESISTANCE CONTACTS THROUGH INTEGRATED PROC...
- Publication number 20170148670
- Publication date May 25, 2017
- Applied Materials, Inc.
- YU LEI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Method for forming a metal gapfill

Process integration approach of selective tungsten via fill

In-situ pre-clean for selectivity improvement for selective deposition

Process integration approach of selective tungsten via fill

Methods for forming low-resistance contacts through integrated proc...

Patents Applicationslast 30 patents

METHOD FOR FORMING A METAL GAPFILL

In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition

PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL

PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL

Methods To Selectively Deposit Corrosion-Free Metal Contacts

Electromigration Improvement Using Tungsten For Selective Cobalt De...

In-Situ Pre-Clean For Selectivity Improvement For Selective Deposition

METHODS FOR FORMING LOW-RESISTANCE CONTACTS THROUGH INTEGRATED PROC...