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Felix C. Li
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Sunnyvale, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Delamination resistant device package having raised bond surface an...
Patent number
8,736,042
Issue date
May 27, 2014
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Delamination resistant device package having low moisture sensitivity
Patent number
8,097,934
Issue date
Jan 17, 2012
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
I/O pad structures for integrated circuit devices
Patent number
7,898,088
Issue date
Mar 1, 2011
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging integrated circuits for high stress environments
Patent number
7,812,463
Issue date
Oct 12, 2010
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power micro surface-mount device package
Patent number
7,564,130
Issue date
Jul 21, 2009
National Semiconductor Corporation
Felix C. Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for forming solder seals for semiconductor fli...
Patent number
7,479,411
Issue date
Jan 20, 2009
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package
Patent number
7,456,503
Issue date
Nov 25, 2008
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless leadframe package substitute and stack package
Patent number
7,432,583
Issue date
Oct 7, 2008
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for enhanced thermal conductivity packages for...
Patent number
7,425,503
Issue date
Sep 16, 2008
National Semiconductor Corporation
Felix C. Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus and method for enhanced thermal conductivity packages for...
Patent number
7,109,587
Issue date
Sep 19, 2006
National Semiconductor Corporation
Felix C. Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Enhanced solder joint strength and ease of inspection of leadless l...
Patent number
7,023,074
Issue date
Apr 4, 2006
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead configuration for inline packages
Patent number
7,005,728
Issue date
Feb 28, 2006
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for forming solder seals for semiconductor fli...
Patent number
6,956,291
Issue date
Oct 18, 2005
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced solder joint strength and ease of inspection of leadless l...
Patent number
6,872,599
Issue date
Mar 29, 2005
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dap isolation process
Patent number
6,797,540
Issue date
Sep 28, 2004
National Semiconductor Corporation
Felix D. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless leadframe package substitute and stack package
Patent number
6,781,243
Issue date
Aug 24, 2004
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DELAMINATION RESISTANT DEVICE PACKAGE HAVING RAISED BOND SURFACE AN...
Publication number
20120080781
Publication date
Apr 5, 2012
National Semiconductor Corporation
Felix C. LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING INTEGRATED CIRCUITS FOR HIGH STRESS ENVIRONMENTS
Publication number
20100006991
Publication date
Jan 14, 2010
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES
Publication number
20090091016
Publication date
Apr 9, 2009
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE
Publication number
20080061408
Publication date
Mar 13, 2008
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Enhanced solder joint strength and ease of inspection of leadless l...
Publication number
20050116321
Publication date
Jun 2, 2005
National Semiconductor Corporation, A Delaware Corp.
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadless leadframe package substitute and stack package
Publication number
20050001294
Publication date
Jan 6, 2005
National Semiconductor Corporation
Felix C. Li
H01 - BASIC ELECTRIC ELEMENTS