Felix P. Anderson

Person

Colchester, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultralow-K dielectric-gap wrapped contacts and method
- Patent number 11,978,661
- Issue date May 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Fuad H. Al-Amoody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming BEOL metal levels with multiple dielectric layer...
- Patent number 10,163,697
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for BEOL metal levels with multiple dielectric layers for...
- Patent number 9,673,091
- Issue date Jun 6, 2017
- GLOBALFOUNDRIES Inc.
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit switches, design structure and methods of fabric...
- Patent number 9,284,185
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Curvilinear wiring structure to reduce areas of high field density...
- Patent number 9,275,951
- Issue date Mar 1, 2016
- GLOBALFOUNDRIES Inc.
- Felix Patrick Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Composite copper wire interconnect structures and methods of forming
- Patent number 8,975,531
- Issue date Mar 10, 2015
- International Business Machines Corporation
- Felix Anderson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing semiconductor devices and a semiconductor...
- Patent number 8,969,195
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Felix P. Anderson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for forming an aluminum fuse for compatibility wi...
- Patent number 8,927,411
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming aluminum fuse for compatibility with...
- Patent number 8,921,975
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal coplanar switches and methods of manufacture
- Patent number 8,878,315
- Issue date Nov 4, 2014
- International Business Machines Corporation
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical integrated circuit switches, design structure and methods...
- Patent number 8,791,778
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical integrated circuit switches, design structure and methods...
- Patent number 8,604,898
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit switches, design structure and methods of fabric...
- Patent number 8,569,091
- Issue date Oct 29, 2013
- International Business Machines Corporation
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Horizontal coplanar switches and methods of manufacture
- Patent number 8,535,966
- Issue date Sep 17, 2013
- International Business Machines Corporation
- Felix P. Anderson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Curvilinear wiring structure to reduce areas of high field density...
- Patent number 8,530,970
- Issue date Sep 10, 2013
- International Business Machines Corporation
- Felix Patrick Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of electrolytic plating and semiconductor device fabrication
- Patent number 8,518,817
- Issue date Aug 27, 2013
- International Business Machines Corporation
- Felix P. Anderson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 8,293,634
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse and pad stress relief
- Patent number 8,137,791
- Issue date Mar 20, 2012
- International Business Machines Corporation
- Felix Patrick Anderson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a metal silicide layer, devices incorporating met...
- Patent number 8,129,844
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal silicide layer, devices incorporating met...
- Patent number 7,851,353
- Issue date Dec 14, 2010
- International Business Machines Corporation
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP methods avoiding edge erosion and related wafer
- Patent number 7,833,907
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annular damascene vertical natural capacitor
- Patent number 7,538,006
- Issue date May 26, 2009
- International Business Machines Corporation
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRALOW-K DIELECTRIC-GAP WRAPPED CONTACTS AND METHOD
- Publication number 20220189818
- Publication date Jun 16, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Fuad H. Al-Amoody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR BEOL METAL LEVELS WITH MULTIPLE DIELECTRIC LAYERS FOR...
- Publication number 20170207121
- Publication date Jul 20, 2017
- GLOBALFOUNDRIES INC.
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LEVEL FORMATION METHOD AND AN INTEGRATED CIRCUIT STRUCTURE HA...
- Publication number 20160379878
- Publication date Dec 29, 2016
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...
- Publication number 20150130064
- Publication date May 14, 2015
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COPPER WIRE INTERCONNECT STRUCTURES AND METHODS OF FORMING
- Publication number 20140202746
- Publication date Jul 24, 2014
- Felix Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WI...
- Publication number 20140106559
- Publication date Apr 17, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Integrated Circuit Switches, Design Structure and Methods...
- Publication number 20140014480
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...
- Publication number 20140017844
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR FORMING ALUMINUM FUSE FOR COMPATIBILITY WITH...
- Publication number 20130320488
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...
- Publication number 20130307158
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE
- Publication number 20130153378
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A R...
- Publication number 20120261813
- Publication date Oct 18, 2012
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...
- Publication number 20120129336
- Publication date May 24, 2012
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ELECTROLYTIC PLATING AND SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20120070979
- Publication date Mar 22, 2012
- International Business Machines Corporation
- Felix P. Anderson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE
- Publication number 20120025331
- Publication date Feb 2, 2012
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WIRING STRUCTURE AND METHOD
- Publication number 20110127673
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...
- Publication number 20110049649
- Publication date Mar 3, 2011
- International Business Machines Corporation
- Felix P. ANDERSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS...
- Publication number 20100263998
- Publication date Oct 21, 2010
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...
- Publication number 20100032829
- Publication date Feb 11, 2010
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING MET...
- Publication number 20090317972
- Publication date Dec 24, 2009
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING MET...
- Publication number 20090317973
- Publication date Dec 24, 2009
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...
- Publication number 20090288869
- Publication date Nov 26, 2009
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP METHODS AVOIDING EDGE EROSION AND RELATED WAFER
- Publication number 20090267192
- Publication date Oct 29, 2009
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...
- Publication number 20090212434
- Publication date Aug 27, 2009
- Felix P. Anderson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FUSE AND PAD STRESS RELIEF
- Publication number 20090155541
- Publication date Jun 18, 2009
- Felix Patrick Anderson
- H01 - BASIC ELECTRIC ELEMENTS

Felix P. Anderson

Person

Patents Grantslast 30 patents

Ultralow-K dielectric-gap wrapped contacts and method

Method for forming BEOL metal levels with multiple dielectric layer...

Structure for BEOL metal levels with multiple dielectric layers for...

Integrated circuit switches, design structure and methods of fabric...

Curvilinear wiring structure to reduce areas of high field density...

Composite copper wire interconnect structures and methods of forming

Methods of manufacturing semiconductor devices and a semiconductor...

System and method for forming an aluminum fuse for compatibility wi...

System and method for forming aluminum fuse for compatibility with...

Horizontal coplanar switches and methods of manufacture

Vertical integrated circuit switches, design structure and methods...

Vertical integrated circuit switches, design structure and methods...

Integrated circuit switches, design structure and methods of fabric...

Horizontal coplanar switches and methods of manufacture

Curvilinear wiring structure to reduce areas of high field density...

Method of electrolytic plating and semiconductor device fabrication

Structures and methods for improving solder bump connections in sem...

Fuse and pad stress relief

Method of forming a metal silicide layer, devices incorporating met...

Method of forming a metal silicide layer, devices incorporating met...

CMP methods avoiding edge erosion and related wafer

Annular damascene vertical natural capacitor

Patents Applicationslast 30 patents

ULTRALOW-K DIELECTRIC-GAP WRAPPED CONTACTS AND METHOD

STRUCTURE FOR BEOL METAL LEVELS WITH MULTIPLE DIELECTRIC LAYERS FOR...

METAL LEVEL FORMATION METHOD AND AN INTEGRATED CIRCUIT STRUCTURE HA...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...

COMPOSITE COPPER WIRE INTERCONNECT STRUCTURES AND METHODS OF FORMING

SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WI...

Vertical Integrated Circuit Switches, Design Structure and Methods...

INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...

SYSTEM AND METHOD FOR FORMING ALUMINUM FUSE FOR COMPATIBILITY WITH...

CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...

HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE

REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A R...

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...

METHOD OF ELECTROLYTIC PLATING AND SEMICONDUCTOR DEVICE FABRICATION

HORIZONTAL COPLANAR SWITCHES AND METHODS OF MANUFACTURE

WIRING STRUCTURE AND METHOD

INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS OF FABRIC...

VERTICAL INTEGRATED CIRCUIT SWITCHES, DESIGN STRUCTURE AND METHODS...

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...

METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING MET...

METHOD OF FORMING A METAL SILICIDE LAYER, DEVICES INCORPORATING MET...

CURVILINEAR WIRING STRUCTURE TO REDUCE AREAS OF HIGH FIELD DENSITY...

CMP METHODS AVOIDING EDGE EROSION AND RELATED WAFER

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...

FUSE AND PAD STRESS RELIEF