Feng CHEN

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Wuxi, CN

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Patents Grantslast 30 patents

Information Patent Grant
Radar component package and method for manufacturing the same
- Patent number 11,346,920
- Issue date May 31, 2022
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing fan out wafer level package
- Patent number 9,773,684
- Issue date Sep 26, 2017
- National Center for Advanced Packaging Co., Ltd.
- Hongjie Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RADAR COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210181297
- Publication date Jun 17, 2021
- National Center for Advanced Packaging Co., Ltd.
- Wenqi Zhang
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING FAN OUT WAFER LEVEL PACKAGE
- Publication number 20160218020
- Publication date Jul 28, 2016
- National Center for Advanced Packaging Co., Ltd.
- Hongjie WANG
- H01 - BASIC ELECTRIC ELEMENTS