Feng-Chi Hung

Person

Chu-Bei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor with overlap of backside trench isolation structure an...
- Patent number 12,255,219
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image-sensing structure and method for forming the same
- Patent number 12,218,164
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for CMOS image sensors including through-substrat...
- Patent number 12,176,370
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite BSI structure and method of manufacturing the same
- Patent number 12,148,782
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,148,781
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 12,040,336
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrodes with notches and methods for forming the same
- Patent number 12,009,214
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
- Patent number 11,984,465
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming image-sensor device with deep-trench isolati...
- Patent number 11,973,101
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked device
- Patent number 11,915,977
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 11,908,878
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,901,387
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,894,410
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bond pad structure
- Patent number 11,804,473
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite BSI structure and method of manufacturing the same
- Patent number 11,791,357
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with overlap of backside trench isolation structure an...
- Patent number 11,791,361
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,596,800
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 11,538,837
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,502,121
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple deep trench isolation (MDTI) structure for CMOS image sensor
- Patent number 11,495,630
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrodes with notches and methods for forming the same
- Patent number 11,456,176
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with overlap of backside trench isolation structure an...
- Patent number 11,437,420
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of image sensing device
- Patent number 11,342,373
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming image-sensor device with deep-trench isolati...
- Patent number 11,342,374
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensing pixel, image sensor and method of fabricating the same
- Patent number 11,335,716
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,282,802
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for bonding improvement
- Patent number 11,244,981
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite bsi structure and method of manufacturing the same
- Patent number 11,211,419
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal block and bond pad structure
- Patent number 11,088,192
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FULL BACKSIDE DEEP TRENCH ISOLATION STRUCTURE FOR A SEMICONDUCTOR P...
- Publication number 20250063834
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-En CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pixel Structures in Image Sensors
- Publication number 20250006762
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240395843
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...
- Publication number 20240379711
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371904
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT
- Publication number 20240355860
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20240313010
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY
- Publication number 20240282799
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURE FOR CMOS IMAGE SENSORS
- Publication number 20240222407
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240186356
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE FOR BONDING IMPROVEMENT
- Publication number 20240162269
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Structure with Reduced Floating Node and Manufacturing...
- Publication number 20240153979
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE WITH MULTIPLE COMPONENTS TO INCREASE IMAGE SENS...
- Publication number 20240030261
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-I Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC STRUCTURE FOR SMALL PIXEL DESIGNS
- Publication number 20240021641
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021643
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230420464
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20230395631
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH OVERLAP OF BACKSIDE TRENCH ISOLATION STRUCTURE AN...
- Publication number 20230361143
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND PAD STRUCTURE
- Publication number 20230361085
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DEEP TRENCH ISOLATION (BDTI) STRUCTURE FOR CMOS IMAGE SENSOR
- Publication number 20230361149
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE
- Publication number 20230317757
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE-SENSING STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230275109
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HSIEN YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Same
- Publication number 20230201613
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE
- Publication number 20230109829
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DEEP TRENCH ISOLATION (MDTI) STRUCTURE FOR CMOS IMAGE SENSOR
- Publication number 20220384495
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20220375971
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH OVERLAP OF BACKSIDE TRENCH ISOLATION STRUCTURE AN...
- Publication number 20220367537
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chi Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Electrodes with Notches and Methods for Forming the Same
- Publication number 20220359205
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH DEEP-TRENCH ISOLATI...
- Publication number 20220293644
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan LIN
- H01 - BASIC ELECTRIC ELEMENTS

Feng-Chi Hung

Person

Patents Grantslast 30 patents

Image sensor with overlap of backside trench isolation structure an...

Semiconductor image-sensing structure and method for forming the same

Stacked structure for CMOS image sensors including through-substrat...

Composite BSI structure and method of manufacturing the same

Image sensor device

Semiconductor imaging device having improved dark current performance

Gate electrodes with notches and methods for forming the same

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Mechanisms for forming image-sensor device with deep-trench isolati...

Stacked integrated circuits with redistribution lines

Interconnect structure for stacked device

Image sensor and manufacturing method thereof

Image sensor

Bond pad structure for bonding improvement

Hybrid bond pad structure

Composite BSI structure and method of manufacturing the same

Image sensor with overlap of backside trench isolation structure an...

Interconnect structure and method of forming same

Semiconductor imaging device having improved dark current performance

Image sensor device

Multiple deep trench isolation (MDTI) structure for CMOS image sensor

Gate electrodes with notches and methods for forming the same

Image sensor with overlap of backside trench isolation structure an...

Manufacturing method of image sensing device

Mechanisms for forming image-sensor device with deep-trench isolati...

Photosensing pixel, image sensor and method of fabricating the same

Semiconductor device structure and method for forming the same

Bond pad structure for bonding improvement

Composite bsi structure and method of manufacturing the same

Metal block and bond pad structure

Patents Applicationslast 30 patents

FULL BACKSIDE DEEP TRENCH ISOLATION STRUCTURE FOR A SEMICONDUCTOR P...

Pixel Structures in Image Sensors

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...

COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME

ETCH BLOCK STRUCTURE FOR DEEP TRENCH ISOLATION RECESS CONTAINMENT

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

IMAGE SENSOR WITH TRANSISTOR HAVING HIGH RELATIVE PERMITTIVITY

STACKED STRUCTURE FOR CMOS IMAGE SENSORS

IMAGE SENSOR

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

BOND PAD STRUCTURE FOR BONDING IMPROVEMENT

Image Sensor Structure with Reduced Floating Node and Manufacturing...

ISOLATION STRUCTURE WITH MULTIPLE COMPONENTS TO INCREASE IMAGE SENS...

DIELECTRIC STRUCTURE FOR SMALL PIXEL DESIGNS

COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR WITH OVERLAP OF BACKSIDE TRENCH ISOLATION STRUCTURE AN...

HYBRID BOND PAD STRUCTURE

BACKSIDE DEEP TRENCH ISOLATION (BDTI) STRUCTURE FOR CMOS IMAGE SENSOR

ISOLATION STRUCTURE TO INCREASE IMAGE SENSOR PERFORMANCE

SEMICONDUCTOR IMAGE-SENSING STRUCTURE AND METHOD FOR FORMING THE SAME

Interconnect Structure and Method of Forming Same

SEMICONDUCTOR IMAGING DEVICE HAVING IMPROVED DARK CURRENT PERFORMANCE

MULTIPLE DEEP TRENCH ISOLATION (MDTI) STRUCTURE FOR CMOS IMAGE SENSOR

IMAGE SENSOR DEVICE

IMAGE SENSOR WITH OVERLAP OF BACKSIDE TRENCH ISOLATION STRUCTURE AN...

Gate Electrodes with Notches and Methods for Forming the Same

MECHANISMS FOR FORMING IMAGE-SENSOR DEVICE WITH DEEP-TRENCH ISOLATI...