Feng-Chien Hsieh

Person

Pingtung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Pixel array including time-of-flight sensors
- Patent number 12,164,034
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,166,048
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with stress adjusting layers
- Patent number 12,154,933
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically arranged semiconductor pixel sensor
- Patent number 12,142,630
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,051,704
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mid-manufacturing semiconductor wafer layer testing
- Patent number 12,033,902
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 12,021,105
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- G01 - MEASURING TESTING
Information Patent Grant
Optical blocking structures for black level correction pixels in an...
- Patent number 11,996,428
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including dark pixel sensors
- Patent number 11,985,438
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast charge transfer floating diffusion region for a photodetector...
- Patent number 11,837,614
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement with isolation structure
- Patent number 11,837,619
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including air gap reflection structures
- Patent number 11,810,936
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- ChunHao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and fabrication method thereof
- Patent number 11,810,933
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensors with stress adjusting layers
- Patent number 11,769,780
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array including octagon pixel sensors
- Patent number 11,670,651
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector using a buried gate electrode for a transfer transist...
- Patent number 11,527,563
- Issue date Dec 13, 2022
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-trimming methods for wafer bonding and dicing
- Patent number 11,482,506
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-function transfer gate electrode for a photodetector and meth...
- Patent number 11,258,971
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor with trenched filler grid
- Patent number 10,340,300
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with trenched filler grid within a dielectric grid inc...
- Patent number 9,490,288
- Issue date Nov 8, 2016
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240421174
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS
- Publication number 20240405047
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR PHASE DETECTION AUTO FOCUS
- Publication number 20240406596
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING
- Publication number 20240395638
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387596
- Publication date Nov 21, 2024
- Traiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Stress Adjusting Layers
- Publication number 20240387595
- Publication date Nov 21, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES
- Publication number 20240386743
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240379705
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS
- Publication number 20240332325
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING DARK PIXEL SENSORS
- Publication number 20240155260
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240113237
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHIEN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240096923
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHIEN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS
- Publication number 20240079422
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240047487
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FENG-CHIEN HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Fingerprint Sensor with Enhanced Anti-Counterfeiting Features
- Publication number 20240021009
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SELECT DIELECTRIC LA...
- Publication number 20240006458
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH HIGH QUANTUM EFFICIENCY
- Publication number 20230402484
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING
- Publication number 20230402330
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SOLAR CELL AND IMAGE SENSOR
- Publication number 20230402482
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY ARRANGED SEMICONDUCTOR PIXEL SENSOR
- Publication number 20230402488
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR INCLUDING A TRANSFER FINFET
- Publication number 20230387152
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE
- Publication number 20230387168
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR
- Publication number 20230387171
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING TIME-OF-FLIGHT SENSORS
- Publication number 20230375712
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufactoring Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING AIR GAP REFLECTION STRUCTURES
- Publication number 20230378214
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL BLOCKING STRUCTURES FOR BLACK LEVEL CORRECTION PIXELS IN AN...
- Publication number 20230369364
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSORS AND METHODS OF FORMATION
- Publication number 20230369369
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAST CHARGE TRANSFER FLOATING DIFFUSION REGION FOR A PHOTODETECTOR...
- Publication number 20230369361
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS
- Publication number 20230067395
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE
- Publication number 20230068723
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien HSIEH
- H01 - BASIC ELECTRIC ELEMENTS

Feng-Chien Hsieh

Person

Patents Grantslast 30 patents

Pixel array including time-of-flight sensors

Pixel array including octagon pixel sensors

Image sensors with stress adjusting layers

Vertically arranged semiconductor pixel sensor

Pixel array including octagon pixel sensors

Mid-manufacturing semiconductor wafer layer testing

Pixel array including octagon pixel sensors

Optical blocking structures for black level correction pixels in an...

Pixel array including dark pixel sensors

Fast charge transfer floating diffusion region for a photodetector...

Semiconductor arrangement with isolation structure

Pixel array including air gap reflection structures

Image sensor device and fabrication method thereof

Image sensors with stress adjusting layers

Pixel array including octagon pixel sensors

Photodetector using a buried gate electrode for a transfer transist...

Edge-trimming methods for wafer bonding and dicing

Multi-function transfer gate electrode for a photodetector and meth...

Image sensor with trenched filler grid

Image sensor with trenched filler grid within a dielectric grid inc...

Patents Applicationslast 30 patents

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

OPTICAL BLOCKING REGIONS FOR PIXEL SENSORS

STRUCTURES AND METHODS FOR PHASE DETECTION AUTO FOCUS

MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING

IMAGE SENSOR DEVICES AND METHODS OF FORMATION

Image Sensors With Stress Adjusting Layers

OPTICAL FINGERPRINT SENSOR WITH ENHANCED ANTI-COUNTERFEITING FEATURES

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS

PIXEL ARRAY INCLUDING DARK PIXEL SENSORS

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Optical Fingerprint Sensor with Enhanced Anti-Counterfeiting Features

BACK SIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SELECT DIELECTRIC LA...

IMAGE SENSOR WITH HIGH QUANTUM EFFICIENCY

MID-MANUFACTURING SEMICONDUCTOR WAFER LAYER TESTING

INTEGRATION OF SOLAR CELL AND IMAGE SENSOR

VERTICALLY ARRANGED SEMICONDUCTOR PIXEL SENSOR

PIXEL SENSOR INCLUDING A TRANSFER FINFET

SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE

DEEP TRENCH ISOLATION STRUCTURE IN A PIXEL SENSOR

PIXEL ARRAY INCLUDING TIME-OF-FLIGHT SENSORS

PIXEL ARRAY INCLUDING AIR GAP REFLECTION STRUCTURES

OPTICAL BLOCKING STRUCTURES FOR BLACK LEVEL CORRECTION PIXELS IN AN...

STACKED IMAGE SENSORS AND METHODS OF FORMATION

FAST CHARGE TRANSFER FLOATING DIFFUSION REGION FOR A PHOTODETECTOR...

PIXEL ARRAY INCLUDING OCTAGON PIXEL SENSORS

SEMICONDUCTOR ARRANGEMENT WITH ISOLATION STRUCTURE