Feng-Chun Yu

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Yuanshan Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Thermally conductive board
- Patent number 11,778,739
- Issue date Oct 3, 2023
- Polytronics Technology Corp.
- Kuo Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated metal substrate and method for manufacturing same
- Patent number 11,511,521
- Issue date Nov 29, 2022
- Polytronics Technology Corp.
- Feng-Chun Yu
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
INSULATED METAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220270950
- Publication date Aug 25, 2022
- POLYTRONICS TECHNOLOGY CORP.
- Feng-Chun YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED METAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220266572
- Publication date Aug 25, 2022
- POLYTRONICS TECHNOLOGY CORP.
- Feng-Chun YU
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMALLY CONDUCTIVE BOARD
- Publication number 20220201856
- Publication date Jun 23, 2022
- POLYTRONICS TECHNOLOGY CORP.
- KUO HSUN CHEN
- H01 - BASIC ELECTRIC ELEMENTS