Feng Jiang

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Wuxi City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Multistage nanoreactor catalyst and preparation and application the...
- Patent number 11,427,516
- Issue date Aug 30, 2022
- Jiangnan University
- Xiaohao Liu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Graphene modified iron-based catalyst and preparation and applicati...
- Patent number 10,946,363
- Issue date Mar 16, 2021
- Jiangnan University
- Xiaohao Liu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Multistage nanoreactor catalyst and preparation and application the...
- Patent number 10,875,817
- Issue date Dec 29, 2020
- Jiangnan University
- Xiaohao Liu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Mechanical debonding method and system
- Patent number 9,368,376
- Issue date Jun 14, 2016
- National Center for Advanced Packaging Co., Ltd.
- Daquan Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Multistage Nanoreactor Catalyst and Preparation and Application The...
- Publication number 20210070672
- Publication date Mar 11, 2021
- JIANGNAN UNIVERSITY
- Xiaohao LIU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Graphene Modified Iron-Based Catalyst and Preparation and Applicati...
- Publication number 20190374928
- Publication date Dec 12, 2019
- JIANGNAN UNIVERSITY
- Xiaohao LIU
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Multistage Nanoreactor Catalyst and Preparation and Application The...
- Publication number 20190092705
- Publication date Mar 28, 2019
- JIANGNAN UNIVERSITY
- Xiaohao Liu
- C07 - ORGANIC CHEMISTRY
Information Patent Application
TSV Wafer Thinning Controlling Method and System
- Publication number 20150099423
- Publication date Apr 9, 2015
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Feng JIANG
- B24 - GRINDING POLISHING
Information Patent Application
Mechanical Debonding Method and System
- Publication number 20140356988
- Publication date Dec 4, 2014
- Daquan Yu
- H01 - BASIC ELECTRIC ELEMENTS