Feng-Lung Chien

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 8,866,293
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump structure on substrate and fabrication method thereof
- Patent number 8,569,162
- Issue date Oct 29, 2013
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming lead-free bump on electronic component
- Patent number 7,341,949
- Issue date Mar 11, 2008
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit probing contact pad formed on a bond pad in a flip chip pac...
- Patent number 6,753,609
- Issue date Jun 22, 2004
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bumbing method for fabricating solder bumps on semiconduc...
- Patent number 6,692,629
- Issue date Feb 17, 2004
- Siliconware Precision Industries Co., Ltd.
- Chih-Shun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bandwidth enhancement of transimpedance amplifier by capacitive pea...
- Patent number 6,353,366
- Issue date Mar 5, 2002
- Telecommunications Laboratories
- Yi-Jen Chan
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of fabricating solder bumps with high coplanarity for flip-c...
- Patent number 6,348,401
- Issue date Feb 19, 2002
- Siliconware Precision Industries Co., Ltd.
- Chih-Shun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming circuit probing contact points on fine pitch peri...
- Patent number 6,258,705
- Issue date Jul 10, 2001
- Siliconeware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20150072517
- Publication date Mar 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP STRUCTURE ON SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130249082
- Publication date Sep 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120280384
- Publication date Nov 8, 2012
- Siliconware Precision Industries Co., Ltd.
- Yi-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF
- Publication number 20120126397
- Publication date May 24, 2012
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20060226542
- Publication date Oct 12, 2006
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming lead-free bump on electronic component
- Publication number 20050042872
- Publication date Feb 24, 2005
- Siliconware Precision Industries Co., Ltd., Taiwan, R.O.C.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PROBING CONTACT PAD FORMED ON A BOND PAD IN A FLIP CHIP PAC...
- Publication number 20020031880
- Publication date Mar 14, 2002
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS

Feng-Lung Chien

Person

Patents Grantslast 30 patents

Semiconductor structure and fabrication method thereof

Conductive bump structure on substrate and fabrication method thereof

Process for forming lead-free bump on electronic component

Circuit probing contact pad formed on a bond pad in a flip chip pac...

Flip-chip bumbing method for fabricating solder bumps on semiconduc...

Bandwidth enhancement of transimpedance amplifier by capacitive pea...

Method of fabricating solder bumps with high coplanarity for flip-c...

Method of forming circuit probing contact points on fine pitch peri...

Patents Applicationslast 30 patents

FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE

CONDUCTIVE BUMP STRUCTURE ON SUBSTRATE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF

Semiconductor device and fabrication method thereof

Process for forming lead-free bump on electronic component

CIRCUIT PROBING CONTACT PAD FORMED ON A BOND PAD IN A FLIP CHIP PAC...