Feng PAN

Person

Wuhan, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 12,142,575
- Issue date Nov 12, 2024
- Yangtza Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 12,137,568
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of three-dimensional memory device
- Patent number 12,137,567
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint opening structures of three-dimensional memory devices and me...
- Patent number 11,956,953
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 11,758,732
- Issue date Sep 12, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 11,527,547
- Issue date Dec 13, 2022
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint opening structures of three-dimensional memory devices and me...
- Patent number 11,482,532
- Issue date Oct 25, 2022
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for testing three-dimensional memory device
- Patent number 10,998,079
- Issue date May 4, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structure of three-dimensional memory device
- Patent number 10,930,663
- Issue date Feb 23, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 10,923,491
- Issue date Feb 16, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint opening structures of three-dimensional memory devices and me...
- Patent number 10,886,291
- Issue date Jan 5, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure of three-dimensional memory device
- Patent number 10,847,531
- Issue date Nov 24, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint opening structures of three-dimensional memory devices and me...
- Patent number 10,847,532
- Issue date Nov 24, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for testing three-dimensional memory device
- Patent number 10,679,721
- Issue date Jun 9, 2020
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid bonding contact structure of three-dimensional memory device
- Patent number 10,593,690
- Issue date Mar 17, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase etch control in forming three-dimensional memory device
- Patent number 10,522,474
- Issue date Dec 31, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-dropout regulators
- Patent number 10,423,176
- Issue date Sep 24, 2019
- Yangtze Memory Technologies Co., Ltd.
- Feng Pan
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240188291
- Publication date Jun 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230363169
- Publication date Nov 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230087468
- Publication date Mar 23, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20230070357
- Publication date Mar 9, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT OPENING STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND ME...
- Publication number 20230016627
- Publication date Jan 19, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20210134826
- Publication date May 6, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT OPENING STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND ME...
- Publication number 20210074718
- Publication date Mar 11, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20210043643
- Publication date Feb 11, 2021
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200295025
- Publication date Sep 17, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200265913
- Publication date Aug 20, 2020
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20200203285
- Publication date Jun 25, 2020
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT OPENNING STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND M...
- Publication number 20190081060
- Publication date Mar 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190067314
- Publication date Feb 28, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-DROPOUT REGULATORS
- Publication number 20190064862
- Publication date Feb 28, 2019
- Yangtze Memory Technologies Co., Ltd.
- Feng PAN
- G05 - CONTROLLING REGULATING
Information Patent Application
STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190057756
- Publication date Feb 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Jong Jun Kim
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190057974
- Publication date Feb 21, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE
- Publication number 20190051610
- Publication date Feb 14, 2019
- Yangtze Memory Technologies Co., Ltd.
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Staircase etch control in forming three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Interconnect structure of three-dimensional memory device

Joint opening structures of three-dimensional memory devices and me...

Hybrid bonding contact structure of three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Joint opening structures of three-dimensional memory devices and me...

Structure and method for testing three-dimensional memory device

Interconnect structure of three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Joint opening structures of three-dimensional memory devices and me...

Interconnect structure of three-dimensional memory device

Joint opening structures of three-dimensional memory devices and me...

Structure and method for testing three-dimensional memory device

Hybrid bonding contact structure of three-dimensional memory device

Staircase etch control in forming three-dimensional memory device

Low-dropout regulators

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE

JOINT OPENING STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND ME...

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

JOINT OPENING STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND ME...

INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE

JOINT OPENNING STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES AND M...

INTERCONNECT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

LOW-DROPOUT REGULATORS

STRUCTURE AND METHOD FOR TESTING THREE-DIMENSIONAL MEMORY DEVICE

HYBRID BONDING CONTACT STRUCTURE OF THREE-DIMENSIONAL MEMORY DEVICE

STAIRCASE ETCH CONTROL IN FORMING THREE-DIMENSIONAL MEMORY DEVICE