Feng-Sheng Kao

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,368,116
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic bo...
- Patent number 12,283,560
- Issue date Apr 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,009,340
- Issue date Jun 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, manufacturing method for the same, and electron...
- Patent number 11,984,393
- Issue date May 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic co...
- Patent number 11,973,047
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,152,331
- Issue date Oct 19, 2021
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140746
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...
- Publication number 20240379534
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...
- Publication number 20240162140
- Publication date May 16, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...
- Publication number 20240162180
- Publication date May 16, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055402
- Publication date Feb 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420391
- Publication date Dec 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369229
- Publication date Nov 16, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260886
- Publication date Aug 17, 2023
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230178451
- Publication date Jun 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsin-Jou Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...
- Publication number 20220068801
- Publication date Mar 3, 2022
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220068867
- Publication date Mar 3, 2022
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20220005786
- Publication date Jan 6, 2022
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200388591
- Publication date Dec 10, 2020
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Drug Screening through Quantitative Detection by Atomic F...
- Publication number 20130029858
- Publication date Jan 31, 2013
- NATIONAL APPLIED RESEARCH LABORATORIES
- Hueih-Min Chen
- G01 - MEASURING TESTING

Feng-Sheng Kao

Person

Patents Grantslast 30 patents

Electronic package and manufacturing method thereof

Electronic package including electronic structure and electronic bo...

Method for fabricating electronic package

Electronic package, manufacturing method for the same, and electron...

Electronic package including electronic structure and electronic co...

Electronic package and method for fabricating the same

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...

ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...

ELECTRONIC PACKAGE INCLUDING ELECTRONIC STRUCTURE AND ELECTRONIC CO...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

Method of Drug Screening through Quantitative Detection by Atomic F...