Feng Ye

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Songjiang Export Process Zone, CN

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulation method for packaging semiconductor components with ex...
- Patent number 7,943,424
- Issue date May 17, 2011
- Alpha and Omega Semiconductor Incorporated
- Limin Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATION METHOD FOR PACKAGING SEMICONDUCTOR COMPONENTS WITH EX...
- Publication number 20110129962
- Publication date Jun 2, 2011
- Alpha and Omega Semiconductor Incorporated
- Limin Wang
- H01 - BASIC ELECTRIC ELEMENTS