Feng Yu

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus, control method and control device of semiconductor packa...
- Patent number 11,774,935
- Issue date Oct 3, 2023
- CAPCON LIMITED
- Hong Gang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging apparatus and method thereof
- Patent number 11,189,507
- Issue date Nov 30, 2021
- CAPCON LIMITED
- Feng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for packaging components
- Patent number 10,734,349
- Issue date Aug 4, 2020
- CAPCON LIMITED
- Feng Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS, CONTROL METHOD AND CONTROL DEVICE OF SEMICONDUCTOR PACKA...
- Publication number 20200241498
- Publication date Jul 30, 2020
- CAPCON LIMITED
- Hong Gang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PACKAGING COMPONENTS
- Publication number 20190088615
- Publication date Mar 21, 2019
- CAPCON LIMITED
- Feng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING APPARATUS AND METHOD THEREOF
- Publication number 20190080942
- Publication date Mar 14, 2019
- CAPCON LIMITED
- Feng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jam detection apparatus and method for indexing of substrates and l...
- Publication number 20060144899
- Publication date Jul 6, 2006
- Xiao Ping Hu
- H01 - BASIC ELECTRIC ELEMENTS